Past RFIC Symposia
This page includes highlights to past RFIC content. For paper award winners and program books, visit the dedicated pages below.
2021 3MT® Competition:
- 1st place: Renuka Bowrothu, University of Florida, "Say Bye-Bye to Spotty Wi-Fi!"
- 2nd place: Valentina Palazzi, University of Perugia, "Tireless Ears for Sensing Vibrations"
- 3rd place: Ricardo Figueiredo, University of Aveiro, "In Science We Trust, But Do Scientists Trust Each Other?"
- Audience choice: Soheil Nouri, University of Arkansas, "Let's Know Our Enemies Before We Fight Them!"
- M/C choice: Yali Zhang, University of Minnesota, Twin Cities, 'Make the Connection Using Nanometer-Sized "Joints" '
- Honorable mention: Ajibayo Adeyeye, Georgia Institute of Technology, "Let’s Play: Microwave Pong"
Dr. Thomas Byunghak Cho, Samsung
EVP Samsung Semiconductor
Is the third wave coming in CMOS RF?
Prof. Ali Hajimiri, Caltech
Bren Prof. of Elect. Eng. and Medical Eng., Caltech
The Flexible Future of RF
Official Photos: Plenary Session | Plenary Reception | All Microwave Week 2019 Galleries
"The Digital Future of RFICs"
Dr. Greg Henderson
Senior Vice President
Automotive, Communications and Aerospace & Defense
Analog Devices, Inc.
"Do the networks of the future care
about the materials of the past?"
Dr. Ir. Michael Peeters
Bell Labs wins the Industry Best Paper Award for their paper “16-Element W-Band Phased Array Transceiver Chipset” and showcases the system in an elaborate setup involving extensive equipment
Shahriar Shahramian and a team from Bell Labs, the industrial research arm of Alcatel-Lucent, won the conference’s first Industry Best Paper Award and showcased the world’s first package-less, fully integrated W-Band phased array chipset for multi-gigabit wireless communication systems. With up to 10GHz of instantaneous bandwidth and EIRP >34dBm at 90GHz, this chipset is capable of establishing >5Gb/s wireless links using spectrally-efficient modulation at a distance of tens of meters. Each chipset is equipped with 4x4 transmit (or receive) phased array elements, 2x2 back-channel elements, I/Q modulators and PLL. The SiGe BiCMOS ICs are directly flip-chipped onto an organic PCB with dual-polarization integrated antenna arrays alongside voltage regulators, microcontrollers and connectors, without the use of any interposer, package or hybrid substrate. This approach provides an exceptionally low-cost solution for deploying W-Band mesh or point-point wireless networks.
2015 RFIC Student Paper Awards:
“A 60GHz Same-Channel Full-Duplex CMOS Transceiver and Link Based on Reconfigurable Polarization-Based Antenna Cancellation”
Tolga Dinc and Prof. Harish Krishnaswamy
Columbia University, USA
“A Switched-Capacitor RF Front End with Embedded Programmable High Order Filtering and a+15 dBm OB-B1dB”
Yang Xu and Prof. Peter R. Kinget
Columbia University, USA
“A Class-C Self-Mixing-VCO Architecture with High Tuning-Range and Low Phase-Noise for mm-Wave Applications”
Amir Hossein, Masnadi Shirazi and Prof. Sudip Shekar
University of British Columbia, Canada