IMS and RFIC Technical Sessions

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Bahar Jalali Farahani, Mahdi Parvizi
Cisco
705/707/709/711
Abstract
According to the latest report by Global Market Insights Inc. the market valuation of optical communication and networking will cross $30 billion by 2027. The significant revenue comes from the emerging technologies such as IoT (Internet of things), machine-to-machine networks, AI, cloud-based services, and web-based applications. Several innovations are underway to enhance the wireline and optical transceiver designs so that they can serve the increase in demand and future generations of applications.
Technical Papers
Abstract
WSK-1: Market Forces and Network Evolution
Martin Zirngibl
Martin Zirngibl, Macom
Macom
(08:00 - 12:00)
Materials
workshops-2022/WSK_1.pdf
Abstract
WSK-2: Advancements in High-Speed Packaging
Clint Schow
Clint Schow, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 12:00)
Materials
workshops-2022/WSK_2.pdf
Abstract
WSK-3: Architecting Wireline Transceivers for Beyond 1Tbps Applications
Tony Chan Carusone
Tony Chan Carusone, Univ. of Toronto
Univ. of Toronto
(08:00 - 12:00)
Materials
workshops-2022/WSK_3.pdf
Abstract
WSK-4: Coherent vs PAM-4 Optics in the Data Center
Alexander Rylyakov
Alexander Rylyakov, Nokia
Nokia
(08:00 - 12:00)
Materials
workshops-2022/WSK_4.pdf
Abstract
WSK-5: Towards Tb/s Coherent Silicon Photonic Links
Sudip Shekhar
Sudip Shekhar, Univ. of British Columbia
Univ. of British Columbia
(08:00 - 12:00)
Materials
workshops-2022/WSK_5.pdf
Alexandre Giry, Jennifer Kitchen
CEA-LETI, Arizona State Univ.
702/704/706
Abstract
Increasing demand for high data rates, reduced latency, and increased device density are driving the development of 5G wireless systems. 5G spectrum is presently covering sub-7GHz (FR1) and mm-wave bands (FR2, FR3,…). This workshop will bring together experts from academia and industry to highlight recent works and performance trends related to 5G-FR1 Power Amplifiers (PAs) and Front-End Modules (FEMs). Multiband and high linearity requirements, along with the need for higher power and reduced power consumption, make the design of 5G-FR1 PA and FEM highly challenging and critical to overall system performance. Recent trends in Doherty, class F/F-1, multi-stage PAs, and Envelope Tracking PA architectures will be highlighted and insights into different design techniques and integration technologies (CMOS, SOI, GaN) will be presented as pathways to enable the integration of future PAs and FEMs. An introduction to emerging heterogeneous technologies combining high-power GaN with CMOS will also provide the attendees with new directions for next-generation PA design and integration.
Technical Papers
Abstract
WSM-1: Power Amplifier Circuit Techniques for 4/5G Mobile Phone Terminals
Satoshi Tanaka
Satoshi Tanaka, Murata Manufacturing
Murata Manufacturing
(08:00 - 12:00)
Materials
workshops-2022/WSM_1.pdf
Abstract
WSM-2: An Overview of Envelope Tracking PAs and Hybrid Supply Modulators in CMOS Technologies
Jennifer Kitchen
Jennifer Kitchen, Arizona State Univ.
Arizona State Univ.
(08:00 - 12:00)
Materials
workshops-2022/WSM_2.pdf
Abstract
WSM-3: Hybrid Architectures and Technologies for Load-Modulated Power Amplifiers
Ayssar Serhan
Ayssar Serhan, CEA-LETI
CEA-LETI
(08:00 - 12:00)
Materials
workshops-2022/WSM_3.pdf
Abstract
WSM-4: Heterogeneous GaN and RFSOI Technology: Device and Circuits
Gregory U'Ren
Gregory U'Ren, X-FAB
X-FAB
(08:00 - 12:00)
Materials
workshops-2022/WSM_4.pdf
Abstract
WSM-5: RF Power Amplifier Architectures to Support Cellular Infrastructure for 5G and Beyond
Joseph Staudinger, Maruf Ahmed
Joseph Staudinger, NXP Semiconductors
NXP Semiconductors, NXP Semiconductors
(08:00 - 12:00)
Materials
workshops-2022/WSM_5.pdf
Antoine Frappé, François Rivet, Fred Lee
IEMN (UMR 8520), IMS (UMR 5218), Twenty/Twenty Therapeutics
708/710/712
Abstract
The human body is a new playground for wireless communications to connect health devices or open new services related to information exchange or security. It faces many constraints such as power consumption, quality of service, reliability, and of course being compatible with the human body. The last decade has seen several innovations that exploit the body as a medium to propagate the information efficiently. This workshop proposes a state-of-the-art of up-to-date research on the topic. It starts with an overview of body area networks and pioneering research on communications and power delivery through the body. It is followed by recent developments on broadband human-body communication transceivers for wearable health monitoring. Then, surface-wave capacitive body-coupled communications are introduced and challenges for upper layers and synchronization of nodes are addressed. Finally, intra-body communications using ultrasounds are explored to complete the scope of this workshop.
Technical Papers
Abstract
WSO-1: Body Area Network — Connecting and Powering Things Together Around the Human Body
Jerald Yoo
Jerald Yoo, NUS
NUS
(08:00 - 12:00)
Materials
workshops-2022/WSO_1.pdf
Abstract
WSO-2: Secure and Efficient Internet of Bodies using Body as a ‘Wire’
Shreyas Sen
Shreyas Sen, Purdue Univ.
Purdue Univ.
(08:00 - 12:00)
Materials
workshops-2022/WSO_2.pdf
Abstract
WSO-3: Capacitive Body-Coupled Communications and Heartbeat-Based MAC Protocol for the Human Intranet
Guillaume Tochou
Guillaume Tochou, STMicroelectronics
STMicroelectronics
(08:00 - 12:00)
Materials
workshops-2022/WSO_3.pdf
Abstract
WSO-4: How About Other Waves for Intra Body Communication? Ultrasound Maybe?
Wim Dehaene
Wim Dehaene, KU Leuven
KU Leuven
(08:00 - 12:00)
Materials
workshops-2022/WSO_4.pdf

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Subhanshu Gupta, Renyuan Wang, Gernot Hueber
Washington State Univ., BAE Systems, Silicon Austria Labs
109/111
Abstract
Wireless networks have fueled socio-economic growth worldwide and are expected to further advance to enable new applications such as autonomous vehicles, virtual/augmented-reality, and smart cities. Due to shortage of sub-6GHz spectrum, mm-wave frequencies play an important role in the emerging 6G and the communication-on-the-move applications. Given that the propagation loss in the lower mm-wave band needs to be compensated by antenna array gain and densification of base stations with cell radius as small as a hundred meters, radio chipsets need to be power and cost efficient. To make radio chipsets power and cost efficient, state-of-the-art mm-wave-net transceivers are designed with phased antenna array (PAA). As a consequence, signal processing techniques and network protocols for mm-wave-nets are designed under constraints of PAA architectures. Future generations of mm-wave-nets will operate in the upper mm-wave frequency band where more than 10GHz bandwidth can be used to meet the ever-increasing demands. Their realization will demand addressing a completely new set of challenges including wider bandwidths, larger antenna array size, and higher cell density. These new system requirements demand fundamental rethinking of radio architectures, signal processing and networking protocols. Major breakthroughs are thus required in radio front-end architectures to enable coherent combining of wideband mm-wave spectrum, as most commonly adopted PAA-based radios face many challenges in achieving fast beam training, interference suppression, and wideband data communication. Through this workshop, we will look at the fundamental issue of coherent signal combination at these large scales from sub-GHz to sub-THz enabled by a diverse group of speakers with expertise spanning circuits, architecture, algorithms, and applications. The coherent combination will bring out true-time-delay array architectures including recent developments in wideband delay compensation methods with large range-to-resolution ratios. The delay compensation at different points of the receiver chain including RF, baseband, and digital will empower not only traditional wireless communications but also spatial signal processing for direction finding and interference suppression.
Technical Papers
Abstract
WSA-1: Key Developments in Low-Cost, Wide-Beam Scanning Phased Arrays for Mobile Airborne Communications
Julio Navarro
Julio Navarro, Boeing
Boeing
(08:00 - 17:00)
Materials
workshops-2022/WSA_1.pdf
Abstract
WSA-2: A Phased Array Perspective on the Importance of True Digital Time Delay for Wide Bandwidth Systems
Andrew Rogers
Andrew Rogers, Northrop Grumman
Northrop Grumman
(08:00 - 17:00)
Materials
workshops-2022/WSA_2.pdf
Abstract
WSA-3: Wideband mm-Wave Beam Training with True-Time-Delay Array Architectures
Danijela Cabric
Danijela Cabric, Univ. of California, Los Angeles
Univ. of California, Los Angeles
(08:00 - 17:00)
Materials
workshops-2022/WSA_3.pdf
Abstract
WSA-4: Overview of TTD from Electrical Optical to Acoustic Domain
Hossein Hashemi
Hossein Hashemi, Univ. of Southern California
Univ. of Southern California
(08:00 - 17:00)
Materials
workshops-2022/WSA_4.pdf
Abstract
WSA-5: Wideband Digital True-Time-Delay Compensation Techniques for Digital Arrays
Michael P. Flynn
Michael P. Flynn, Univ. of Michigan
Univ. of Michigan
(08:00 - 17:00)
Materials
workshops-2022/WSA_5.pdf
Abstract
WSA-6: Beamforming for Large, Wideband Phased Arrays: Advanced True-Time Delay and Associated Digital Control Implementations
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM
IBM
(08:00 - 17:00)
Materials
workshops-2022/WSA_6.pdf
Abstract
WSA-7: Circuits and Architectures for Multi-Gb/s mm-Wave and sub-THz Wireless Transceivers in FinFET CMOS
Stefano Pellerano
Stefano Pellerano, Intel
Intel
(08:00 - 17:00)
Materials
workshops-2022/WSA_7.pdf
Abstract
WSA-8: Front-End Architectures for 100Gbps and More at sub-THz Frequencies
Jose-Luis Gonzalez-Jimenez
Jose-Luis Gonzalez-Jimenez, CEA-LETI
CEA-LETI
(08:00 - 17:00)
Materials
workshops-2022/WSA_8.pdf
Nuno Borges Carvalho, Alessandra Costanzo
Instituto de Telecomunicações, Univ. of Bologna
102/ 104/ 106
Abstract
5G and future 6G wireless communications have an objective to massively deploy IoT sensors everywhere; this is important for smart cities, health sensors, space exploration and so on. In this workshop the combination of wireless power transmission, wireless communications and energy harvesting will be presented with clear applications in several use cases. Academics around the world and industry will be presenting their latest developments.
Technical Papers
Abstract
WSB-1: Zero-Power Flexible Wireless Modules and Additively Manufactured Electronics for IoT, SmartAg and Smart Cities Ultra-Broadband Applications
Manos M. Tentzeris
Manos M. Tentzeris, Georgia Tech
Georgia Tech
(08:00 - 17:00)
Materials
workshops-2022/WSB_1.pdf
Abstract
WSB-2: Rectifier Design Challenges Towards Beyond 5G/6G Implementation
Kenjiro Nishikawa
Kenjiro Nishikawa, Kagoshima Univ.
Kagoshima Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSB_2.pdf
Abstract
WSB-3: Latest Advances in High-Performance SWIPT Combined with Backscattering
Dominique Schreurs
Dominique Schreurs, KU Leuven
KU Leuven
(08:00 - 17:00)
Materials
workshops-2022/WSB_3.pdf
Abstract
WSB-4: Towards a SWIPT Distributed Network Based on WPT and Backscatter Solution
Nuno Borges Carvalho
Nuno Borges Carvalho, Instituto de Telecomunicações
Instituto de Telecomunicações
(08:00 - 17:00)
Materials
workshops-2022/WSB_4.pdf
Abstract
WSB-5: From Frequency Domain to Time Domain Multiplexing-Based SWIPT
Valentina Palazzi, Luca Roselli
Valentina Palazzi, Università di Perugia
Università di Perugia, Università di Perugia
(08:00 - 17:00)
Materials
workshops-2022/WSB_5.pdf
Abstract
WSB-6: Near-and-Far Field Solution for Energy Autonomous Communication
Alessandra Costanzo
Alessandra Costanzo, Univ. of Bologna
Univ. of Bologna
(08:00 - 17:00)
Materials
workshops-2022/WSB_6.pdf
Abstract
WSB-7: A New SWIPT System for Structural Health Monitoring of Civil Engineering Structures
Alex Takacs, Daniela Dragomirescu
Alex Takacs, LAAS-CNRS
LAAS-CNRS, LAAS-CNRS
(08:00 - 17:00)
Materials
workshops-2022/WSB_7.pdf
Abbas Omar, Raafat R. Mansour, Ke Wu
OvG Universität Magdeburg, Univ. of Waterloo, Polytechnique Montréal
108/110
Abstract
Utilizing mm-waves in mobile communications has been known to be associated with much lower radiation powers and much shorter communication ranges. This has given rise to what are called “Microcells” and “Picocells”, whose coverage areas do not exceed a few meters. These cells are responsible for the communication with the User Equipment (UE). Their backhaul communications with high-power Base Stations (BS) are either wired (usually fiber-optical) or in a Line-of-Sight (LOS) scenario. LOS wireless communications do not involve wave-matter interactions, as any LOS obstacle heavily deteriorates the communication quality. Health aspects of 5G and beyond is therefore limited to the extremely low-power short-range Picocell-UE communication. Another related relevant aspect is the very strong mm-wave attenuation in water-rich substances characterizing biological tissues. mm-Waves cannot therefore penetrate into biological objects (eg human and animal bodies and plants) more than few millimeters. Health aspects must therefore be investigated within the skin area. Deeper inside the body, mm-waves assume negligible intensities, which are much safer than those of earlier standards (eg 3G and 4G). A group of very competent scientists will talk at this workshop. These represent standardization institutions, academic scientists involved in health issues of electromagnetic radiations, and physicists, who can qualitatively estimate the in-vivo radiation levels and the electromagnetic loss mechanisms dominating the wave-matter interactions in biological substances. The expected results should be very calming for the public, as it will be shown that the major standards (eg ICNIRP, IEEE, and ANSI) allow for harmless radiation levels, and this has been justified by the long-time experience with man-made radiation in the last decades (broadcasting and different wireless communication modalities). It will also be shown that social-media widely-spread views of pseudoscience and conspiracy theorists claiming serious health hazards, which are caused generally by mm-wave radiation and particularly as related to 5G and beyond, are clearly BASELESS. To a great extent, these claims are based on mixing up ionizing and nonionizing radiation. The mechanisms of wave-matter interactions in the latter are fully described by the constitutive parameters: permittivity, permeability, and conductivity for weak and moderate field intensities that do not involve nonlinearities. These are macroscopic quantities (spatial moving averages) that average out spatial microscopic details. The averaging window is at most a few hundredths of wavelength wide. Possible changes in critical and sensitive atomic or molecular structures (similar to that existing in eg DNA or nerve cells) cannot considerably exceed the macroscopic average. The latter is a reversible thermal one, as long as the radiated power levels do not exceed those dictated by the Regulatory Agencies (eg FCC in USA).
Technical Papers
Abstract
WSC-1: Wave-Matter Interaction at mm-Wave Frequencies
Abbas Omar
Abbas Omar, OvG Universität Magdeburg
OvG Universität Magdeburg
(08:00 - 17:00)
Materials
workshops-2022/WSC_1.pdf
Abstract
WSC-2: This is Your Brain on 5G
Peter Siegel, David Gultekin
Peter Siegel, Caltech
Caltech, Columbia Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSC_2.pdf
Abstract
WSC-3: Evaluation of the Impact of RF Electromagnetic Waves on Cells with Near-Field Exposure Instrumentations
Katia Grenier
Katia Grenier, LAAS-CNRS
LAAS-CNRS
(08:00 - 17:00)
Materials
workshops-2022/WSC_3.pdf
Abstract
WSC-4: RF Exposure Levels from Mobile Phones and Base Stations
C-K Chou
Abbas Omar, OvG Universität Magdeburg
C-K. Chou Consulting
(08:00 - 17:00)
Abstract
WSC-5: New Challenges Related to 5G Bioelectromagnetic Exposure for Laboratories Studies
Delia Arnaud-Cormos, Rosa Orlacchio, Philippe Leveque
Delia Arnaud-Cormos, XLIM (UMR 7252), Rosa Orlacchio, XLIM (UMR 7252), Philippe Leveque, XLIM (UMR 7252)
XLIM (UMR 7252), XLIM (UMR 7252), XLIM (UMR 7252)
(08:00 - 17:00)
Materials
workshops-2022/WSC_5.pdf
Abstract
WSC-6: RF Exposure Limits: Evolution and Current Issues
Ken Foster
Abbas Omar, OvG Universität Magdeburg
Univ. of Pennsylvania
(08:00 - 17:00)
Materials
workshops-2022/WSC_6.pdf
Abstract
WSC-7: Behavioral studies of pollinator interaction with 5G range electromagnetic radiation
Chris Palego
Chris Palego, Bangor Univ.
Bangor Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSC_7.pdf
Abstract
WSC-8: Health Aspects of 5G Antennas: current low-level evidences and experimental design strategies
Sandra Costanzo
Sandra Costanzo, Univ. of Calabria
Univ. of Calabria
(08:00 - 17:00)
Materials
workshops-2022/WSC_8.pdf
Didier Belot, Wolfgang Heinrich
CEA-LETI, FBH
201/203
Abstract
Telecom communities are beginning to prepare the next generation of mobile telecom, the 6G, and present KPIs going to the Tbps, 300GHz carrier frequency, space multiplexing, spectrum agility, dense Massive MIMO, wide bands, and so forth. Serving these challenges, microelectronics communities must re-think their medium term roadmap: what role can CMOS processes play? Is SiGe HBT a good answer to these KPIs? Do we need more exotic technologies such as III-V HBT or HEMT? How to do Heterogeneous Integrations, in a 3D approach? How to integrate antennas and passives?
Technical Papers
Abstract
WSD-1: Toward 6G: From New Hardware Design to Wireless Semantic and Goal-Oriented Communication Paradigms
Emilio Calvanese Strinati
Emilio Calvanese Strinati, CEA-LETI
CEA-LETI
(08:00 - 17:00)
Materials
workshops-2022/WSD_1.pdf
Abstract
WSD-2: Technology Challenges for 6G
Nadine Collaert, Piet Wambacq
Nadine Collaert, IMEC
IMEC, IMEC
(08:00 - 17:00)
Materials
workshops-2022/WSD_2.pdf
Abstract
WSD-3: Advanced 200mm and 300mm RF SOI and BiCMOS Technologies Targeting 5G and Beyond (6G) RF Front-End Module SOC
Frederic Gianesello
Frederic Gianesello, STMicroelectronics
STMicroelectronics
(08:00 - 17:00)
Materials
workshops-2022/WSD_3.pdf
Abstract
WSD-4: SiGe HBT for mm-Wave and THz Applications
Mohamed Hussein Eissa
Mohamed Hussein Eissa, IHP
IHP
(08:00 - 17:00)
Materials
workshops-2022/WSD_4.pdf
Abstract
WSD-5: 2.5D and 3D Integrations for mm-Wave and THz Applications
Tanja Braun
Tanja Braun, Fraunhofer IZM
Fraunhofer IZM
(08:00 - 17:00)
Materials
workshops-2022/WSD_5.pdf
Abstract
WSD-6: FinFET CMOS for mm-Wave Applications
Stefano Pellerano, Said Rami
Said Rami, Intel
Intel, Intel
(08:00 - 17:00)
Materials
workshops-2022/WSD_6.pdf
Abstract
WSD-7: InP HBT for mm-Wave and THz Applications
Wolfgang Heinrich
Wolfgang Heinrich, FBH
FBH
(08:00 - 17:00)
Materials
workshops-2022/WSD_7.pdf
Abstract
WSD-8: 100nm to 40nm GaN-on-Si for mm-Wave Application
Remy Leblanc
Remy Leblanc, OMMIC
OMMIC
(08:00 - 17:00)
Materials
workshops-2022/WSD_8.pdf
Abstract
WSD-9: InGaAs mHEMTs: Technology and Circuit Aspects for mm-Wave and THz Applications
Fabian Thome
Fabian Thome, Fraunhofer IAF
Fraunhofer IAF
(08:00 - 17:00)
Materials
workshops-2022/WSD_9.pdf
Abstract
WSD-10: A Technology-Design Roadmap Addressing 300GHz Connectivity
Baudouin Martineau
Baudouin Martineau, CEA-LETI
CEA-LETI
(08:00 - 17:00)
Materials
workshops-2022/WSD_10.pdf
Steven Callender, Sungwon Chung
Intel, Neuralink
205/207
Abstract
The Power Amplifier (PA) continues to be a critical building block in mm-wave communication systems, often dictating the overall system efficiency and can thereby impose constraints on system deployment (eg max phased-array size due to thermal constraints). As such, many publications focus on efficiency enhancement techniques for mm-wave power amplifiers. However, when used in systems targeting “5G and Beyond” applications, transceiver bandwidths must be suitable to meet the high data-rate specifications, and hence, maximum PA efficiency cannot be blindly pursued. Instead, efficiency enhancement techniques must be explored in close consideration of their implications on bandwidth which is what this workshop aims to explore more deeply. The goal of this workshop is three-fold: 1) familiarize the audience with PA specifications required for next-gen applications, 2) review well-known (and emerging) efficiency enhancement techniques for mm-wave PAs with perspectives on attainable bandwidth, and 3) discuss techniques to enhance bandwidth while maintaining adequate efficiency required for practical systems. The workshop features talks which will highlight PA specifications for two of the forefront “5G and Beyond” applications — radar and large-scale phased-arrays — covering the 20–100+ GHz, along with reference designs suitable for such applications. In addition, there will discussion on design methodologies for maximizing bandwidth while optimizing efficiency in the context of mm-wave and sub-THz linear amplifiers and mm-wave Doherty amplifiers. Lastly, an emerging efficiency enhancement technique, the sub-harmonic switching amplifier, will also be presented.
Technical Papers
Abstract
WSE-1: Broadband, Back-Off Efficient, and VSWR Resilient mm-Wave PA Architectures Across 30–100+ GHz in CMOS/SiGe/InP
Kaushik Sengupta, Zheng Liu
Kaushik Sengupta, Princeton Univ.
Princeton Univ., Princeton Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSE_1.pdf
Abstract
WSE-2: Design of mm-Wave Power Amplifiers for Radar Applications in CMOS and SiGe HBT Technologies
Vadim Issakov, Vincent Lammert, Sascha Breun
Vadim Issakov, Technische Univ. Braunschweig
Technische Univ. Braunschweig, Infineon Technologies, FAU Erlangen-Nürnberg
(08:00 - 17:00)
Materials
workshops-2022/WSE_2.pdf
Abstract
WSE-3: mm-Wave CMOS Power Amplifiers for 5G Base Station Applications
Hyun-Chul Park, Jooseok Lee, Joonho Jung, Seungjae Baek, Taewan Kim, Sung-Gi Yang
Hyun-Chul Park, Samsung
Samsung, Samsung, Samsung, Samsung, Samsung, Samsung
(08:00 - 17:00)
Materials
workshops-2022/WSE_3.pdf
Abstract
WSE-4: mm-Wave CMOS PAs for 5G Handsets
Sherif Shakib, Jeremy Dunworth, Vladimir Aparin
Sherif Shakib, Qualcomm
Qualcomm, Qualcomm, Qualcomm
(08:00 - 17:00)
Materials
workshops-2022/WSE_4.pdf
Abstract
WSE-5: High Efficiency D-Band Multi-Way Power Combined Amplifiers in 45nm CMOS RFSOI
Siwei Li, Gabriel M. Rebeiz
Siwei Li, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(08:00 - 17:00)
Materials
workshops-2022/WSE_5.pdf
Abstract
WSE-6: Broadband mm-Wave PA Design in Advanced FinFET CMOS
Steven Callender, Ritesh Bhat
Steven Callender, Intel
Intel, Intel
(08:00 - 17:00)
Materials
workshops-2022/WSE_6.pdf
Abstract
WSE-7: mm-Wave Doherty PA with Bandwidth Enhancement Techniques for 5G and Beyond
Fei Wang
Fei Wang, Georgia Institute of Technology
Georgia Institute of Technology
(08:00 - 17:00)
Materials
workshops-2022/WSE_7.pdf
Abstract
WSE-8: Subharmonic Switching 5G PAs for Efficiency Enhancement
Aoyang Zhang
Aoyang Zhang, Harvard Univ.
Harvard Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSE_8.pdf
Alirio Boaventura, Michael Hamilton
NIST, Auburn Univ.
401-402
Abstract
Quantum computers hold the promise to perform certain complex calculations that are not solvable even with today’s most powerful supercomputers. But despite the significant progress made in the last decade in the science and engineering of quantum computation systems, several challenges remain to be overcome before quantum computation can become practically usable. A key challenge relates to system scalability — fault-tolerant quantum computation will likely require thousands or millions of quantum bits (qubits), far beyond the capacity of current prototypes. Today’s most prominent candidate for implementing large-scale systems, the superconducting qubit platform, operates in the microwave regime and is controlled and readout via conventional microwave electronics operating at room temperature. While the current room temperature control and readout approach works for small-scale experiments, it is not scalable to thousands or millions of qubits. The engineering challenges of realizing practical large-scale systems present quantum microwave engineers with new opportunities in microwave modeling, design, and characterization of cryogenic semiconductor and superconductor devices, circuits, and systems. This workshop will address emerging techniques and technologies for quantum information processing including low-temperature measurements and calibrations, cryogenic packaging and interconnects, monolithic semiconductor-based quantum processors, and quantum-classical interfaces based on cryogenic CMOS and Josephson superconductive electronics.
Technical Papers
Abstract
WSF-1: Cryo-CMOS Systems and Circuits for Large-Scale Quantum Computers
Fabio Sebastiano
Fabio Sebastiano, Technische Universiteit Delft
Technische Universiteit Delft
(08:00 - 17:00)
Materials
workshops-2022/WSF_1.pdf
Abstract
WSF-2: Packaging and Interconnect Challenges for Cryogenic and Quantum Systems
Michael Hamilton
Michael Hamilton, Auburn Univ.
Auburn Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSF_2.pdf
Abstract
WSF-3: Josephson Junction Based Control Electronics for Superconducting Qubits
Adam Sirois
Adam Sirois, NIST
NIST
(08:00 - 17:00)
Materials
workshops-2022/WSF_3.pdf
Abstract
WSF-4: Cryogenic Microwave Measurement and Characterization Approaches for Communications and Quantum Information
Alirio Boaventura
Alirio Boaventura, NIST
NIST
(08:00 - 17:00)
Materials
workshops-2022/WSF_4.pdf
Abstract
WSF-5: Towards Automated Microwave Measurements and Calibrations at Millikelvin Temperatures
Rich Chamberlin, Elyse McEntee Wei
Rich Chamberlin, NIST, Elyse McEntee Wei, NIST
NIST, NIST
(08:00 - 17:00)
Materials
workshops-2022/WSF_5.pdf
Abstract
WSF-6: Application of a VNA for Measurement of Superconducting Microwave Resonators
Suren Singh
Suren Singh, Keysight Technologies
Keysight Technologies
(08:00 - 17:00)
Materials
workshops-2022/WSF_6.pdf
Abstract
WSF-7: Developing S-Parameter Measurement Setups for Characterizing Superconducting Qubit Circuits at mK Temperatures
Kyle Thompson
Kyle Thompson, Maybell Quantum Industries
Maybell Quantum Industries
(08:00 - 17:00)
Materials
workshops-2022/WSF_7.pdf
Abstract
WSF-8: Towards Millions of Qubits in a Quantum SoC
Robert Bogdan Staszewski, Imran Bashir, Elena Blokhina
Robert Bogdan Staszewski, Univ. College Dublin, Imran Bashir, Equal1 Labs
Univ. College Dublin, Equal1 Labs, Univ. College Dublin
(08:00 - 17:00)
Materials
workshops-2022/WSF_8.pdf
Hsieh-Hung Hsieh, Tim LaRocca, Qun Jane Gu
TSMC, Northrop Grumman, Univ. of California, Davis
403-404
Abstract
With recent 5G deployment underway, the focus of wireless research is shifting toward 6G, which is expected to have a peak data rate of 1Tb/s and air latency less than 100 microseconds, 50 times the peak data rate and one-tenth the latency of 5G. To achieve Tb/s transmissions in 6G, it is inevitable to utilize the frequency band over 100GHz or sub-THz due to enormous amount of available bandwidth. However, the use of such high frequency bands results in more design challenges of RF circuits including output power, noise, linearity, signal conversion, and high-quality signal source for 6G communications and sensing. In addition, the optimal phased array architecture needs to be carefully analyzed such that the compact and energy-efficient system package can be attained. Moreover, to compensate for the severe mm-wave or sub-THz path loss, a large number of phased array is required to enhance EIRP and SNR while appropriate designs are necessary to establish reliable wireless links and ensure the array performance. Failure in any of these will prevent us from moving forward regarding the development of 6G. In this workshop, the main theme to be discussed concentrates on mm-wave design challenges and solutions for 6G wireless communications, especially targeting RF circuits. The workshop starts with an overview of mm-wave 6G to illustrate the whole picture to the audience. Afterwards, the RF design challenges based on silicon technologies to realize 6G systems are paid more attention while the innovative design techniques are provided such that the advantages of low cost and high-level integration in silicon can be still obtained. For in-depth exploration, being a critical building block in RF front-ends, mm-wave and sub-THz PA is specially under discussion to investigate the design bottlenecks as well as technology limitations, and the potential solutions and technology directions are presented. Besides RF designs, the analysis of phased-array architecture suitable for 6G applications is mentioned while the analog and digital beamforming structures are compared. In this workshop, to overcome the hurdles arising from silicon technologies, a new silicon-compatible III-V technology is introduced to facilitate 6G RF front-end designs. This workshop also covers the mm-wave and sub-THz communication and sensing systems from the top-down perspective for the comprehensive demonstration of 6G realization.
Technical Papers
Abstract
WSG-1: Overview of mm-Wave 6G: Opportunities and Challenges
Gary Xu
Gary Xu, Samsung
Samsung
(08:00 - 17:00)
Materials
workshops-2022/WSG_1.pdf
WSG-2: Energy-efficiency in Power Amplifiers and Transmitters for Digital Beamforming Arrays above 100 GHz
James Buckwalter
James Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:00)
Materials
workshops-2022/WSG_2.pdf
Abstract
WSG-3: Practical Approaches to Industrializing Near-THz Communication Systems
Shahriar Shahramian
Shahriar Shahramian, Nokia Bell Labs
Nokia Bell Labs
(08:00 - 17:00)
Materials
workshops-2022/WSG_3.pdf
Abstract
WSG-4: mm-Wave RF Transceiver Designs Over 100GHz for 6G Wireless Communications
Kenichi Okada
Kenichi Okada, Tokyo Tech
Tokyo Tech
(08:00 - 17:00)
Materials
workshops-2022/WSG_4.pdf
Abstract
WSG-5: mm-Wave PA Design Challenges and Solutions for 6G Applications
Hua Wang
Hua Wang, ETH Zürich
ETH Zürich
(08:00 - 17:00)
Materials
workshops-2022/WSG_5.pdf
Abstract
WSG-6: Next-Generation Phased Arrays for 6G mm-Wave Wireless Communications
Siwei Li, Gabriel M. Rebeiz
Siwei Li, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(08:00 - 17:00)
Materials
workshops-2022/WSG_6.pdf
Abstract
WSG-7: Joint 3D Sensing and Communication at mm-Wave
Arun Paidimarri
Arun Paidimarri, IBM T.J. Watson Research Center
IBM T.J. Watson Research Center
(08:00 - 17:00)
Materials
workshops-2022/WSG_7.pdf
Abstract
WSG-8: Heterogeneous III-V/CMOS Technologies for Beyond-5G and 6G Solutions to RF Front-End Circuits
Nadine Collaert
Nadine Collaert, IMEC
IMEC
(08:00 - 17:00)
Materials
workshops-2022/WSG_8.pdf
Vadim Issakov, Omeed Momeni
Technische Univ. Braunschweig, Univ. of California, Davis
501-502
Abstract
The amount of sensing applications at mm-wave frequencies is continuously growing. Most of the applications can be addressed by classical radar techniques, but not all. Additional types of novel energy efficient sensing concepts for near-field imaging arrays and spectroscopy are being investigated. This full-day workshop covers near-field sensing and advanced state of the art radar techniques at mm-wave and THz frequencies. The intention is to showcase the unique applications and innovative concepts for sensing different materials and parameters including vital signs, small motions and distances, permittivity, humidity and gas density, and biomolecules using mm-wave to THz frequencies. The first half of the workshop will focus on various solutions for mm-wave and THz imaging and spectroscopy. For example, real-time THz super-resolution near-field imaging will be discussed, as well as transceivers at THz for gas spectroscopy. Advantages and disadvantages of various sensing approaches will be discussed. In the second half, we will discuss the latest trends and future directions in mm-wave radar systems. We will focus specifically on novel mm-wave radar modulation schemes, advanced system and circuit realizations. The emphasis is on digital radar modulation techniques, such as OFDM, PMCW, spread-spectrum, and their advantages or disadvantages versus classical FMCW radar realizations. The main idea of the workshop is to give an overview on mm-wave and THz sensing concepts and show the future directions for the advanced mm-wave radar radar transceivers.
Technical Papers
Abstract
WSH-1: Towards High-Angular-Resolution Radar Imaging at Sub-THz
Ruonan Han
Ruonan Han, MIT
MIT
(08:00 - 17:00)
Materials
workshops-2022/WSH_1.pdf
Abstract
WSH-2: An Integrated-Circuit Approach to THz Bio-Medical Applications
Ullrich R. Pfeiffer
Ullrich R. Pfeiffer, Bergische Universität Wuppertal
Bergische Universität Wuppertal
(08:00 - 17:00)
Materials
workshops-2022/WSH_2.pdf
Abstract
WSH-3: RFIC design challenges dealing with mm-wave massive MIMO radars
Nadav Mazor, P Svalänge
P Svalänge, Vayyar Imaging, Nadav Mazor, Vayyar Imaging
Vayyar Imaging, Vayyar Imaging
(08:00 - 17:00)
Materials
workshops-2022/WSH_3.pdf
Abstract
WSH-4: Fully Integrated FMCW Radars: Devices to Systems
Ehsan Afshari
Ehsan Afshari, Univ. of Michigan
Univ. of Michigan
(08:00 - 17:00)
Abstract
WSH-5: Advanced Digital Modulation Schemes for mm-Wave Radar Systems
Thomas Zwick
Thomas Zwick, KIT
KIT
(08:00 - 17:00)
Materials
workshops-2022/WSH_5.pdf
Abstract
WSH-6: Highly-Integrated PMCW and FMCW Radar Systems on Chip in CMOS
Ilja Ocket
Ilja Ocket, IMEC
IMEC
(08:00 - 17:00)
Materials
workshops-2022/WSH_6.pdf
Abstract
WSH-7: System-Level Considerations on mm-Wave Radar for Proximity Sensing
Vincent Lammert, Matteo Bassi
Vincent Lammert, Infineon Technologies
Infineon Technologies, Infineon Technologies
(08:00 - 17:00)
Materials
workshops-2022/WSH_7.pdf
Alyosha Molnar, Harish Krishnaswamy, Jin Zhou
Cornell Univ., Columbia Univ., Univ. of Illinois at Urbana-Champaign
503-504
Abstract
Modern transceivers often rely on many discrete components, such as SAW and BAW filters and duplexers, to protect them from interference. The number of these discrete front-end components is expected to grow further as more bands are made available at RF and mm-wave frequencies, limiting the system cost, form factor and flexibility. Also, while integrated self-interference cancellation has been demonstrated, many challenges remain at the antenna interface and scaling to phased-array and MIMO transceivers. In this workshop, experts from academic and industry will present the state-of-the-art interference mitigation approaches that can be applied to integrated wireless transceivers. Finally, the workshop will conclude with an interactive panel discussion about the potential and limitations of integrated interference mitigation.
Technical Papers
Abstract
WSI-1: Introduction to RF and mm-Wave Interference Mitigation (Past Work and Future Directions)
Alyosha Molnar
Alyosha Molnar, Cornell Univ.
Cornell Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSI_1.pdf
Abstract
WSI-2: Multi-Blocker-Tolerant Passive MIMO Receivers
Ramesh Harjani
Ramesh Harjani, Univ. of Minnesota
Univ. of Minnesota
(08:00 - 17:00)
Materials
workshops-2022/WSI_2.pdf
Abstract
WSI-3: Passive-Mixer-First Acoustic-Filtering Superheterodyne RF Front-Ends
Jin Zhou
Jin Zhou, Univ. of Illinois at Urbana-Champaign
Univ. of Illinois at Urbana-Champaign
(08:00 - 17:00)
Materials
workshops-2022/WSI_3.pdf
Abstract
WSI-4: Integrated Non-Reciprocal Components: Design, Applications and Future Directions
Aravind Nagulu
Aravind Nagulu, Washington Univ. in St. Louis
Washington Univ. in St. Louis
(08:00 - 17:00)
Materials
workshops-2022/WSI_4.pdf
Abstract
WSI-5: Multi-Antenna Full-Duplex Receivers
Mahmood Dastjerdi
Mahmood Dastjerdi, MiXComm
MiXComm
(08:00 - 17:00)
Materials
workshops-2022/WSI_5.pdf
Abstract
WSI-6: Transceiver Techniques for FDD and Full-Duplex Wireless
Emanuel Cohen
Emanuel Cohen, Technion
Technion
(08:00 - 17:00)
Materials
workshops-2022/WSI_6.pdf
Abstract
WSI-7: Time-Approximation Filter for Direct RF Transmitter
Shiyu Su, Shuo-Wei Chen
Shiyu Su, Univ. of Southern California
Univ. of Southern California, Univ. of Southern California
(08:00 - 17:00)
Materials
workshops-2022/WSI_7.pdf
Abstract
WSI-8: Mitigation of Reciprocal Mixing Caused by Phase Noise and Spurs in Wideband RF Receivers
Hao Wu
Hao Wu, Broadcom
Broadcom
(08:00 - 17:00)
Materials
workshops-2022/WSI_8.pdf
Raja Pullela, Oren Eliezer, Travis Forbes
MaxLinear, Ambiq, Sandia National Laboratories
605/607
Abstract
This workshop will walk you through the steps involved in designing today’s complex radios for applications such as infrastructure cellular, Wi-Fi or mm-wave beam forming arrays from a systems perspective. The workshop caters to students, as well as experienced engineers in the industry, with background in RF systems, circuit design or standards, who are interested in expanding the scope of their knowledge beyond the narrow design tasks they may be exposed to. Attendees will learn how system specifications are derived, how we partition design between RF/Analog/Mixed-signal and digital sections to achieve the most optimum solution in terms of size, power, external BOM. You will hear from speakers who are experts in their areas: a mix from industry and academia. Standards related specification and product level requirements that drive architecture or topology choices will be presented. Using Wi-Fi 802.11be emerging standard as an example, we will outline the salient features and how they compare with previous generations. We will address design considerations imposed by the new standard requirements, with particular focus on RF. Presentations focused on base station cellular transceivers will illustrate the differences between narrow-band (mixer-based) and Direct Sampling/Synthesis approaches. Using microwave and mm-wave point to point communication systems, we will go over design aspects such as line-up analysis to arrive at block level specifications. We will present transmit/receive circuit/system challenges in large-scale arrays, followed by approaches towards realizing scalable, digital-intensive large-scale arrays. Design advances in critical building blocks, such as blocker tolerant receivers and ADPLLs will also be discussed. We will present built-in self-calibration techniques and built-in mitigation of self-interference, leading to reduced production testing costs and high production yields. Calibration techniques to overcome impairments such as IQ error or LO offset calibration and Digital Pre-Distortion (DPD) for linearization of power amplifiers will be discussed.
Technical Papers
Abstract
WSJ-1: Design Considerations for Radios for Cellular Infrastructure
David McLaurin
David McLaurin, Analog Devices
Analog Devices
(08:00 - 17:00)
Abstract
WSJ-2: Wireless Point to Point Communication System Design Considerations
Vamsi Paidi
Vamsi Paidi, MaxLinear
MaxLinear
(08:00 - 17:00)
Materials
workshops-2022/WSJ_2.pdf
Abstract
WSJ-3: Design Considerations for Direct RF Sampling and Synthesis Wideband Radios
Gabriele Manganaro
Gabriele Manganaro, MediaTek
MediaTek
(08:00 - 17:00)
Materials
workshops-2022/WSJ_3.pdf
Abstract
WSJ-4: Recent Trends in Low-Power Low-Jitter Digital Phase-Locked Loops
Teerachot Siriburanon
Teerachot Siriburanon, Univ. College Dublin
Univ. College Dublin
(08:00 - 17:00)
Materials
workshops-2022/WSJ_4.pdf
Abstract
WSJ-5: Design Considerations for Next-Generation Wi-Fi Standards
Sigurd Schelstraete
Sigurd Schelstraete, MaxLinear
MaxLinear
(08:00 - 17:00)
Materials
workshops-2022/WSJ_5.pdf
Abstract
WSJ-6: Beamforming and MIMO Transceivers for Communication and Radar Systems
Arun Natarajan
Arun Natarajan, Oregon State Univ.
Oregon State Univ.
(08:00 - 17:00)
Materials
workshops-2022/WSJ_6.pdf
Abstract
WSJ-7: Receiver Design Techniques to Maintain Sensitivity in the Presence of Large Blockers
Travis Forbes
Travis Forbes, Sandia National Laboratories
Sandia National Laboratories
(08:00 - 17:00)
Materials
workshops-2022/WSJ_7.pdf
Abstract
WSJ-8: Design for Manufacturability in High-Volume Extensively Digital RF Transceivers
Oren Eliezer
Oren Eliezer, Ambiq
Ambiq
(08:00 - 17:00)
Materials
workshops-2022/WSJ_8.pdf

-

Asad Abidi
Univ. of California, Los Angeles
601-603
Abstract
Even circuit designers who are experienced with low noise design can find it difficult to explain how noise is quantified and analyzed.

I will explain the formal methods of quantifying noise and illustrate their use in the design of a variety of common RF circuits. For linear time-invariant circuits such as small-signal amplifiers, noise transfer functions play a key role. For time-varying circuits such as passive mixers and LC oscillators, noise is in many cases injected in discrete time. Methods for the design continue to evolve towards greater simplicity, and I will present some of them.

There is seldom a noise optimum in these circuits. It is usually a tradeoff, as I will show, between noise, large-signal linearity, and power dissipation.

-

Rocco Tam, Yao-Hong Liu
NXP Semiconductors, IMEC
705/707/709/711
Abstract
Wireless proximity communication provides many unique features over conventional wireless communication such as ultra-high data rate, superior data privacy, energy efficiency, mechanical reliability, precision ranging and bandwidth density. However, those unique features always come with many design trade-offs in system complexity, effective communication distance, energy efficiency and system robustness. In this workshop, we are going to go over several wireless proximity communication techniques such as Mid-Field powering and communication for bio-medical implants, impulse ultra-wide-band and mm-wave. The first and second workshops will introduce the applications in latest UWB standard (IEEE 802.15.4z), and the design trade off in commercial UWB SoC system and circuit design. The third workshop will focus on Mid-Field technology for powering and communication with biomedical neuromodulation implants. This technology offers advantages such as significantly smaller, implanted deeper, implant complexity, patient complication and post-surgical pain. The last work workshop presents the overview of solid-state-based mm-wave wireless interconnects from fundamental research to commercialization.
Technical Papers
Abstract
WSL-1: Energy-Efficient IEEE 802.15.4z IR-UWB Transceiver Design
Minyoung Song
Minyoung Song, Holst Centre
Holst Centre
(13:30 - 17:00)
Materials
workshops-2022/WSL_1.pdf
Abstract
WSL-2: Ultra-Wide Band Technology, New Era, New Use Cases
Babak Vakili-Amini, Henrik Jensen, Jan van Sinderen, Rozi Roufoogaran
Babak Vakili-Amini, NXP Semiconductors
NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors
(13:30 - 17:00)
Materials
workshops-2022/WSL_2.pdf
Abstract
WSL-3: Mid-Field Technology for Biomedical Neuromodulation Implantable System
Alexander Yeh
Alexander Yeh, NeuSpera Medical
NeuSpera Medical
(13:30 - 17:00)
Materials
workshops-2022/WSL_3.pdf
Abstract
WSL-4: mm-Wave Contactless Connectors: From Fundamental Research to Commercialization
Yanghyo Kim
Yanghyo Kim, Stevens Institute of Technology
Stevens Institute of Technology
(13:30 - 17:00)
Materials
workshops-2022/WSL_4.pdf
Xun Luo, Debopriyo Chowdhury
UESTC, Broadcom
702/704/706
Abstract
The power amplifiers (PA) and transmitters are the last door in the RF front-end for both the digital and analog kingdoms, one which greatly affects the quality of service (QoS) of the wireless link for modern RF communication, such as 5G, IoT, and beyond. Due to the multi-function trends nowadays, this workshop will showcase the digitally intensive PAs and transmitters, which attract much attention due to their highly reconfigurable nature and rapid development that is on pace with the decreasing scale of CMOS technology. In the first talk, with the aim to powering the next generation of wireless communication, from RF to mm-wave, a series of switched capacitor power amplifiers are discussed. Then, CMOS digital power amplifier and transmitter for efficient signal amplification and beam steering are introduced in the second talk. Next, in the third talk, the all digital transmitter with GaN switching mode power amplifiers with high power efficiency is discussed. Later, digital polar transmitter for impulse-radio ultrawide band communication is introduced in the fourth talk. Finally, the high-performance digital-to-analog converter design towards a digital transmitter is discussed in the fifth talk.
Technical Papers
Abstract
WSN-1: Switched Capacitor Power Amplifiers: Powering the Next Generation of Wireless Communication, from RF to mm-Wave
Jeffrey Walling
Jeffrey Walling, Virginia Tech
Virginia Tech
(13:30 - 17:00)
Materials
workshops-2022/WSN_1.pdf
Abstract
WSN-2: All Digital Transmitter with GaN Switching Mode Power Amplifiers
Rui Ma
Rui Ma, MERL
MERL
(13:30 - 17:00)
Materials
workshops-2022/WSN_2.pdf
Abstract
WSN-3: CMOS Digital Power Amplifier and Transmitter for Efficient Signal Amplification and Beam Steering
Huizhen Jenny Qian
Aoyang Zhang, Harvard Univ.
UESTC
(13:30 - 17:00)
Materials
workshops-2022/WSN_3.pdf
Abstract
WSN-4: Digitally Intensive Power Amplifier Based Transmitter for Ultra-Low Power RF Communication
Minyoung Song
Minyoung Song, Holst Centre
Holst Centre
(13:30 - 17:00)
Materials
workshops-2022/WSN_4.pdf
Abstract
WSN-5: High-Performance Digital-to-Analog Converter Design Towards A Digital Transmitter
Mike Shuo-Wei Chen
Mike Shuo-Wei Chen, Univ. of Southern California
Univ. of Southern California
(13:30 - 17:00)
Materials
workshops-2022/WSN_5.pdf

-

Hossein Hashemi
Univ. of Southern California
Jeyanandh Paramesh
Carnegie Mellon Univ.
1A-1C
Abstract
This session covers highly-integrated mm-wave transmitters and receivers realized in CMOS technologies. The first paper demonstrates a mixer-first receiver with an embedded FIR filter that is approximated by a non-uniform sampler and time-approximation filtering. The second paper demonstrates a concurrent dual-band 5G mm-wave MIMO receiver with beam-space frequency-domain multiplexing. The third paper demonstrates a mm-wave transceiver supporting frequency division and full duplexing thanks to an on-chip circulator. The forth paper demonstrates a satellite terminal beamforming transmitter with embedded beam-scan and cross-polarization calibration schemes. The fifth paper presents a wideband passive harmonic-reject mixer receiver with high IF bandwidth.
Technical Papers
Abstract
RMo1A-1: A Millimeter-Wave Mixer-First Receiver with Non-Uniform Time-Approximation Filter Achieving >45dB Blocker Rejection
Ce Yang, Shiyu Su, Mike Shuo-Wei Chen
Ce Yang, Univ. of Southern California
Univ. of Southern California, Univ. of Southern California, Univ. of Southern California
(08:00 - 08:20)
Abstract
RMo1A-2: A 28GHz/39GHz Dual-Band Four-Element MIMO RX with Beamspace Multiplexing at IF in 65nm CMOS
Robin Garg, Paul Dania, Gaurav Sharma, Armagan Dascurcu, Soumya Gupta, Harish Krishnaswamy, Arun Natarajan
Paul Dania, Oregon State Univ.
Oregon State Univ., Oregon State Univ., Oregon State Univ., Columbia Univ., Oregon State Univ., Columbia Univ., Oregon State Univ.
(08:20 - 08:40)
Abstract
RMo1A-3: A Millimeter-Wave Front-End for FD/FDD Transceivers Featuring an Embedded PA and an N-Path Filter Based Circulator Receiver
Masoud Pashaeifar, Leo C.N. de Vreede, Morteza S. Alavi
Morteza S. Alavi, Technische Universiteit Delft
Technische Universiteit Delft, Technische Universiteit Delft, Technische Universiteit Delft
(08:40 - 09:00)
Abstract
RMo1A-4: A Ka-Band Dual Circularly Polarized CMOS Transmitter with Adaptive Scan Impedance Tuner and Active XPD Calibration Technique for Satellite Terminal
Dongwon You, Yun Wang, Xi Fu, Hans Herdian, Xiaolin Wang, Ashbir Fadila, Hojun Lee, Michihiro Ide, Sena Kato, Zheng Li, Jian Pang, Atsushi Shirane, Kenichi Okada
Dongwon You, Tokyo Tech
Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech, Tokyo Tech
(09:00 - 09:20)
Abstract
RMo1A-5: A 8–30GHz Passive Harmonic Rejection Mixer with 8GHz Instantaneous IF Bandwidth in 45RFSOI
Amr Ahmed, Gabriel M. Rebeiz
Amr Ahmed, Univ. of California, San Diego
Univ. of California, San Diego, Univ. of California, San Diego
(09:20 - 09:40)
Emanuel Cohen
Technion
Ramesh Harjani
Univ. of Minnesota
1D-1F
Abstract
This session presents high-frequency cryogenic low noise and low power amplifiers and advanced front-end circuits. The cryogenic LNAs utilize modern FinFET and CMOS-SOI technologies for compatibility with future quantum computers. The front-end modules for sub-6GHz radios use N-path techniques for reduced harmonic response wideband IF and highly integrated WiFi 6 solutions.
Technical Papers
Abstract
RMo1B-1: A 4.2–9.2GHz Cryogenic Transformer Feedback Low Noise Amplifier with 4.5K Noise Temperature and Noise-Power Matching in 22nm CMOS FDSOI
Boce Lin, Hamdi Mani, Phil Marsh, Richard Al Hadi, Hua Wang
Boce Lin, Georgia Tech
Georgia Tech, CryoElec, Carbonics, Alcatera, Georgia Tech
(08:00 - 08:20)
Abstract
RMo1B-2: A 2.57mW 5.9–8.4GHz Cryogenic FinFET LNA for Qubit Readout
Jean-Olivier Plouchart, Dereje Yilma, John Timmerwilke, Sudipto Chakraborty, Kevin Tien, Alberto Valdes-Garcia, Daniel Friedman
Jean-Olivier Plouchart, IBM
IBM, IBM, IBM, IBM, IBM, IBM, IBM
(08:20 - 08:40)
Abstract
RMo1B-3: A Mixer-First Receiver Frontend with Resistive-Feedback Baseband Achieving 200MHz IF Bandwidth in 65nm CMOS
Benqing Guo, Haishi Wang, Yao Wang, Ke Li, Lei Li, Wanting Zhou
Danilo Manstretta, Univ. of Pavia
CUIT, CUIT, Zhengzhou University, CUIT, UESTC, UESTC
(08:40 - 09:00)
Abstract
RMo1B-4: A Feedback-Based N-Path Receiver with Reduced Input-Node Harmonic Response
Venkata S. Rayudu, Ki Yong Kim, David Z. Pan, Ranjit Gharpurey
Venkata S. Rayudu, Univ. of Texas at Austin
Univ. of Texas at Austin, Univ. of Texas at Austin, Univ. of Texas at Austin, Independent Researcher
(09:00 - 09:20)
Abstract
RMo1B-5: A Linear High-Power Reconfigurable SOI-CMOS Front-End Module for WI-FI 6/6E Applications
D. Parat, A. Serhan, P. Reynier, R. Mourot, A. Giry
A. Giry, CEA-LETI
CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI
(09:20 - 09:40)
Raja Pullela
MaxLinear
Yao-Hong Liu
IMEC
4A-4C
Abstract
This session presents system-level innovations for emerging applications, including quantum computing, distributed implants and beamforming. The first paper describes an RFIC-based system that simplifies the control of Qubits at room temperature. The second and third papers present wireless data/power transfer innovations for implantable devices that enable bi-directional networking and distributed nerve stimulation. The fourth paper describes a mm-wave multi-beam repeater creating beams at different frequencies and in different directions using N-path circuits.
Technical Papers
Abstract
RMo1C-1: An Integrated Quantum Spin Control System in 180nm CMOS
Kaisarbek Omirzakhov, Mohamad Hossein Idjadi, Tzu-Yung Huang, S. Alexander Breitweiser, David A. Hopper, Lee C. Bassett, Firooz Aflatouni
Kaisarbek Omirzakhov, Univ. of Pennsylvania
Univ. of Pennsylvania, Univ. of Pennsylvania, Univ. of Pennsylvania, Univ. of Pennsylvania, Univ. of Pennsylvania, Univ. of Pennsylvania, Univ. of Pennsylvania
(08:00 - 08:20)
Abstract
RMo1C-2: A Wireless Network of 8.8mm³ Bio-Implants Featuring Adaptive Magnetoelectric Power and Multi-Access Bidirectional Telemetry
Zhanghao Yu, Wei Wang, Joshua C. Chen, Zhiyu Chen, Yan He, Amanda Singer, Jacob T. Robinson, Kaiyuan Yang
Zhanghao Yu, Rice Univ.
Rice Univ., Rice Univ., Rice Univ., Rice Univ., Rice Univ., Rice Univ., Rice Univ., Rice Univ.
(08:20 - 08:40)
Abstract
RMo1C-3: Miniaturized Wirelessly Powered and Controlled Implants for Vagus Nerve Stimulation
Iman Habibagahi, Jaeeun Jang, Aydin Babakhani
Iman Habibagahi, Univ. of California, Los Angeles
Univ. of California, Los Angeles, Univ. of California, Los Angeles, Univ. of California, Los Angeles
(08:40 - 09:00)
Abstract
RMo1C-4: Multi-Beam, Scalable 28GHz Relay Array with Frequency and Spatial Division Multiple Access Using Passive, High-Order N-Path Filters
Parham P. Khial, Samir Nooshabadi, Austin Fikes, Ali Hajimiri
Samir Nooshabadi, Caltech
Caltech, Caltech, Caltech, Caltech
(09:00 - 09:20)

-

Charles Baylis, Albin J. Gasiewski, Dimitrios Peroulis
Baylor Univ., University of Colorado Boulder, Purdue Univ.
505-507
Abstract
Passive, scientific microwave systems perform crucial functions: providing early warning to massive populations to protect from hurricanes, winter storms, and other natural disasters, and enabling scientific understanding of astronomical phenomena. The recent addition of fifth-generation (5G) wireless into mm-wave spectral bands near those designated for these sensitive scientific observations, and expected future expansion of wireless communications to additional, higher-frequency bands, has jeopardized the fidelity of these sensing operations due to interference. However, wireless communications connects societies across the globe, and is a key driver of global economic stimulation, and as such must continue to expand while ensuring scientific measurements can continue. This workshop will overview both this challenge and new solutions at the microwave circuit and system levels to provide coexistence between active and passive spectrum-use systems. The workshop begins with specific discussions of a roadmap for developing coexistence between passive scientific and 5G wireless systems from the National Science Foundation and European Space Agency, challenges faced by passive systems, and perspectives from the commercial wireless industry. With this background, the next talks highlight microwave circuit and systems innovations that form promising solutions to this problem, including reconfigurable circuit design for 5G wireless systems, artificially intelligent power amplifier arrays, and a spectral broker for coordination between active and passive spectrum systems. The workshop will conclude with a panel session for extensive audience interaction with all speakers.
Technical Papers
Abstract
WMJ-1: Introduction and Audience Poll of Topical Interest
(08:00 - 12:00)
Materials
workshops-2022/WMJ_1.pdf
Abstract
WMJ-2: Protecting Science: Roadmap for Coexistence Between Passive Scientific Systems and Wireless Communications
Ashley VanderLey
Ashley VanderLey, National Science Foundation
National Science Foundation
(08:00 - 12:00)
Materials
workshops-2022/WMJ_2.pdf
Abstract
WMJ-3: The European Space Agency’s Experience on the Coexistence between Passive and Active Applications
Yan Soldo
Yan Soldo, ESA-ESTEC
ESA-ESTEC
(08:00 - 12:00)
Materials
workshops-2022/WMJ_3.pdf
Abstract
WMJ-4: Potential Technology Models for Active-Passive Coexistence
Albin J. Gasiewski
Albin J. Gasiewski, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 12:00)
Materials
workshops-2022/WMJ_4.pdf
Abstract
WMJ-5: Extension of Commercial Shared Spectrum Frameworks to Passive/Active Coexistence
Andrew Clegg
Andrew Clegg, Google
Google
(08:00 - 12:00)
Materials
workshops-2022/WMJ_5.pdf
Abstract
WMJ-6: Reconfigurable Circuit Design and Load Modulation Techniques for 5G Coexistence with Weather Radiometry
Dimitrios Peroulis, Kenle Chen
Dimitrios Peroulis, Purdue Univ., Kenle Chen, Univ. of Central Florida
Purdue Univ., Univ. of Central Florida
(08:00 - 12:00)
Materials
workshops-2022/WMJ_6.pdf
Abstract
WMJ-7: Spectral/Spatial Broker and Array Impedance Tuning for Real-Time Active/Passive System Spectral Coexistence
Charles Baylis, Sarah Seguin
Charles Baylis, Baylor Univ., Sarah Seguin, Baylor Univ.
Baylor Univ., Baylor Univ.
(08:00 - 12:00)
Materials
workshops-2022/WMJ_7.pdf
Abstract
WMJ-8: Panel Session: The Way Forward
(08:00 - 12:00)
Materials
workshops-2022/WMJ_8.pdf
Jon Kraft
Analog Devices
705/707/ 709/711
Abstract
Phased array communications and radar systems are finding increased use in a variety of applications. This places a greater importance on training engineers and rapidly prototyping new phased array concepts. However, both those imperatives have historically been difficult and expensive. But a recent open source offering, the ADALM-PHASER, allows real beamforming hardware to be used for education, project proposals, and product development. This workshop will introduce that offering with lectures and hands on labs covering: software defined radio (SDR), phased array beamforming (steering angle and beam formation), antenna impairments (side lobes/tapering, grating lobes, beam squint, quantization sidelobes), Monopulse tracking implementation, and simple radar algorithm design. Each of these topics will be addressed with a short lecture, followed by the participants using the ADALM-PHASER hardware to directly explore the lecture topic.
Technical Papers
Abstract
WMM-1: Introduction to Phased Array Hardware Design and Frequency Planning
Matthew Pierce
Matthew Pierce, Ball Aerospace
Ball Aerospace
(08:00 - 12:00)
Materials
workshops-2022/WMM_1.pdf
Abstract
WMM-2: SDR and System Level Control
Robin Getz
Robin Getz, Analog Devices
Analog Devices
(08:00 - 12:00)
Materials
workshops-2022/WMM_2.pdf
Abstract
WMM-3: Phased Array Beam Formation
Laila Fighera Marzall
Laila Fighera Marzall, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 12:00)
Materials
workshops-2022/WMM_3.pdf
Abstract
WMM-4: Antenna Impairments in Phased Array Systems
Bob Broughton
Bob Broughton, Analog Devices
Analog Devices
(08:00 - 12:00)
Materials
workshops-2022/WMM_4.pdf
Abstract
WMM-5: Hybrid Beamformer and Monopulse Tracking
Peter Moschetti, Brad Allen
Peter Moschetti, Lockheed Martin, Brad Allen, Lockheed Martin
Lockheed Martin, Lockheed Martin
(08:00 - 12:00)
Materials
workshops-2022/WMM_5.pdf
Abstract
WMM-6: Introduction to Phased Array Radar Design and Algorithms
Peter Delos
Peter Delos, Analog Devices
Analog Devices
(08:00 - 12:00)
Materials
workshops-2022/WMM_6.pdf
Changzhan Gu, Pingshan Wang, Perry Li, Jessi Johnson
SJTU, Clemson Univ., Abbott, Altruem Consulting
708/710/ 712
Abstract
Systems that utilize RF, microwave and mm-wave energy are becoming increasingly important in the commercial medical device world. In the design of new medical devices, the use of high-frequency electromagnetics must be considered. For example, an implant such as a pacemaker should not require surgically-based battery replacement, but should be wirelessly rechargeable. A neurostimulator should be configurable and controllable by a phone or tablet. A vital sign sensor should allow for non-contact measurements to maximize comfort and usability. Wearable medical sensors should stream data wirelessly to a central location for display and analysis by medical professionals. These examples are just a few of the reasons why RF, microwave and mm-wave devices are of increasing importance and can be routinely found in government approved medical devices around the world. As RF, microwave and mm-wave technology rapidly advances in the academic and commercial environment, it will continue to be adapted toward medical applications in new and interesting ways. Please join our panel of industry experts for an interactive discussion about the in-roads that high-frequency approaches have made in the medical device space. Example applications include high-power RF/microwave ablation for cancer and cardiac applications, radar-based vital-sign sensing, in-body or on-body communication systems, wireless-power techniques, and cell detection and characterization. Panelists will share their perspective on both the current state-of-the-art, as well as future applications of this invaluable technology. In addition to technical content, unique considerations for the industry such as clinical study development, the regulatory approval process and the marketing of medical devices will be discussed.
Technical Papers
Abstract
WMO-1: RF Innovations in Design of Next Generation Medical Devices
Anil Kumar RamRakhyani
Anil Kumar RamRakhyani, Verily
Verily
(08:00 - 12:00)
Materials
workshops-2022/WMO_1.pdf
Abstract
WMO-2: mm-Wave Radars for Healthcare Monitoring
Xinen Zhu
Xinen Zhu, SGR Semiconductors
SGR Semiconductors
(08:00 - 12:00)
Materials
workshops-2022/WMO_2.pdf
Abstract
WMO-3: Wearable Sensors
Eric Chow
Eric Chow, Abbott
Abbott
(08:00 - 12:00)
Materials
workshops-2022/WMO_3.pdf
Abstract
WMO-4: Changing the Cancer Treatment Pathway using Microwave and RF Energy
Chris Hancock
Chris Hancock, Creo Medical
Creo Medical
(08:00 - 12:00)
Materials
workshops-2022/WMO_4.pdf
Abstract
WMO-5: Modeling RF and Microwave Energy Absorption in Biological Tissue
Arlen Ward
Arlen Ward, System Insight Engineering
System Insight Engineering
(08:00 - 12:00)

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Dimitra Psychogiou, Roberto Gómez-García, Michael Höft
Univ. College Cork, Universidad de Alcalá, CAU
109/111
Abstract
This workshop will focus on recent advances in emerging manufacturing and integration processes for 3D microwave and mm-wave RF filters for the next generation of wireless and satellite communication systems. In particular, the workshop will present new RF design and electromagnetic modeling techniques for new classes of RF filtering components (bandpass/bandstop filters, multi-band filters and multiplexers) based on well-established manufacturing processes such as CNC machining and Si-based microfabrication that enables the realization of RF filters from mm-waves to frequencies in the sub-THz region (eg 700GHz). Furthermore, the workshop will provide an overview of emerging digital additive manufacturing processes such as stereolithography, selective laser sintering for new types of materials such as ceramics, plastics and metals and their application to advanced RF filtering architectures. The potential of these processes for complex geometries as well as for RF filters with advanced RF performance, high-frequency of operation, small form factor and low weight will be discussed in detail. Lastly, the workshop will present new RF design methodologies and novel RF filtering architectures that are uniquely enabled by the manufacturing flexibility of 3D printing that facilitates the realization of unconventional shapes.
Technical Papers
Abstract
WMA-1: Advanced and Adaptive Waveguide Filter Configurations for W-Band and Beyond
Chad Bartlett, Daniel Miek, Michael Höft
Michael Höft, CAU
CAU, CAU, CAU
(08:00 - 17:00)
Materials
workshops-2022/WMA_1.pdf
Abstract
WMA-2: Recent Development in AFSIW Filtering and Passive Components Toward Advanced Systems on Substrates
Anthony Ghiotto
Anthony Ghiotto, IMS (UMR 5218)
IMS (UMR 5218)
(08:00 - 17:00)
Materials
workshops-2022/WMA_2.pdf
Abstract
WMA-3: Silicon Micromachining Enabling High-Q Filter Solutions from D-Band to THz Frequencies
Joachim Oberhammer
Joachim Oberhammer, KTH
KTH
(08:00 - 17:00)
Materials
workshops-2022/WMA_3.pdf
Abstract
WMA-4: Waveguide-Based Filtering Components Using New Manufacturing Techniques
Oilid Bouzekri, Yi Wang
Oilid Bouzekri, European Space Agency
European Space Agency, Univ. of Birmingham
(08:00 - 17:00)
Materials
workshops-2022/WMA_4.pdf
Abstract
WMA-5: Additive Manufacturing Processes in Ceramic and Metal for the Fabrication of RF Filters
Reinhard Teschl
Reinhard Teschl, Technische Universität Graz
Technische Universität Graz
(08:00 - 17:00)
Materials
workshops-2022/WMA_5.pdf
Abstract
WMA-6: Advanced Ceramics and Manufacturing Technologies Applied to 3D Filters
Nicolas Delhote
Nicolas Delhote, XLIM (UMR 7252)
XLIM (UMR 7252)
(08:00 - 17:00)
Materials
workshops-2022/WMA_6.pdf
Abstract
WMA-7: Monolithic Integration Concepts for Highly-Versatile and Highly-Miniaturized Coaxial RF Filters Enabled by SLA 3D Printing
Dimitra Psychogiou
Dimitra Psychogiou, Univ. College Cork
Univ. College Cork
(08:00 - 17:00)
Materials
workshops-2022/WMA_7.pdf
WMA-8: Compact Realizations of Advanced Filter Responses in Planar and 3D Waveguide Technologies
A. Sharma, E. Messaoudi, V. Boria, J. Martinez, Santiago Cogollos, M. Guglielmi
Santiago Cogollos, Univ. Politècnica de València
Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València
(08:00 - 17:00)
Abstract
WMA-9: How to Exploit the High Flexibility of Additive Manufacturing in Filter Design
Cristiano Tommassoni
Cristiano Tommassoni, Università di Perugia
Università di Perugia
(08:00 - 17:00)
Materials
workshops-2022/WMA_9.pdf
Abstract
WMA-10: Shape Deformation as a Tool for Miniaturization of 3D Printed Microwave Filters
Adam Lamecki, Michał Mrozowski
Adam Lamecki, Gdansk University of Technology
Gdansk University of Technology, Gdansk University of Technology
(08:00 - 17:00)
Materials
workshops-2022/WMA_10.pdf
Gabriel M. Rebeiz
Univ. of California, San Diego
102/104/106
Abstract
There has been a tremendous advance in satellite communications in the past 3 years. First, Starlink (LEO) has sent upwards of 1600 satellites and is now building 5000 user terminals A WEEK (all based on phased-arrays), OneWeb (LEO) has secured $5B of funding and has sent 400 satellites and will be ready for operation in December 2021, Amazon Kuiper is building their LEO constellation as we speak, SES with mPower and their 2000-beam phased-arrays in a MEO constellation can now provide 500 Mbps to thousands of ISP (internet service providers) at the same time, and Viasat and HNS have both launched their GEO Tbps satellites each with 300+ beams. All of these units require advanced phased-arrays on the ground for user terminals and SATCOM-On-the-Move. This workshop will address advances in these low-cost ground terminals and in the LEO/MEO/GEO constellations, and will present the silicon technologies needed for this work.
Technical Papers
Abstract
WMB-1: High Performance Silicon Beamformers for Next Generation Satcom Internet Connectivity
Tumay Kanar
Tumay Kanar, Renesas Electronics
Renesas Electronics
(08:00 - 17:00)
Materials
workshops-2022/WMB_1.pdf
Abstract
WMB-2: Electronically Scanned Arrays in SATCOM Systems
Matt Little
Matt Little, Ball Aerospace
Ball Aerospace
(08:00 - 17:00)
Materials
workshops-2022/WMB_2.pdf
Abstract
WMB-3: Bits in Space: Delivering Connectivity to the Next 4B Subscribers
Alex Margomenos
Alex Margomenos, GLOBALFOUNDRIES
GLOBALFOUNDRIES
(08:00 - 17:00)
Materials
workshops-2022/WMB_3.pdf
Abstract
WMB-4: Foundry Technologies for Satcom and Emerging Commercial Wireless
David Howard
David Howard, Tower Partners Semiconductor Company
Tower Partners Semiconductor Company
(08:00 - 17:00)
Materials
workshops-2022/WMB_4.pdf
Abstract
WMB-5: High Performance Ku and Ka Band SATCOM Phased Arrays for LEO, MEO and GEO Terminals
Gokhan Gultepe
Gokhan Gultepe, Extreme Waves
Extreme Waves
(08:00 - 17:00)
Materials
workshops-2022/WMB_5.pdf
Abstract
WMB-6: Ka-Band AESA for Satellite Communications — Development and Challenges for Low SWaP-C
Hiroyuki Joba, Takahashi Tomohiro
Takahashi Tomohiro, Mitsubishi Electric Corp., Hiroyuki Joba, Mitsubishi Electric
Mitsubishi Electric, Mitsubishi Electric Corp.
(08:00 - 17:00)
Materials
workshops-2022/WMB_6.pdf
Abstract
WMB-7: Next Generation Satellite Systems — Opportunities and Challenges
Mu Li
Mu Li, Hughes Network Systems, LLC
Hughes Network Systems, LLC
(08:00 - 17:00)
Materials
workshops-2022/WMB_7.pdf
Abstract
WMB-8: High Performance Active Phased Arrays for MEO constellations: Challenges and Opportunities
Ashok Rao
Ashok Rao, SES
SES
(08:00 - 17:00)
Materials
workshops-2022/WMB_8.pdf
Abstract
WMB-11: Project Kuiper Technology
Nima Mahanfar
Nima Mahanfar, Amazon
Amazon
(08:00 - 17:00)
Materials
workshops-2022/WMB_11.pdf
Abstract
WMB-12: Ubiquitous Mobile Connectivity Through Commercial SATCOM
Julio Navarro
Julio Navarro, Boeing
Boeing
(08:00 - 17:00)
Materials
workshops-2022/WMB_12.pdf
Abstract
WMB-13: Enabling Phased Arrays in Space
John Cowles
John Cowles, Analog Devices
Analog Devices
(08:00 - 17:00)
Materials
workshops-2022/WMB_13.pdf
Tejinder Singh, Gwendolyn Hummel, Atif Shamim
Dell Technologies, Sandia National Laboratories, KAUST
108/110
Abstract
The extremely crowded and rapidly changing modern spectral environment has significantly increased the demand for highly reconfigurable RF technologies of high performance and small size. While RF switches are key elements in modern wireless communications and defense applications, switch performance has been stagnant for the last decade. With 5G being rapidly implemented and 6G on the horizon, RF systems are moving to the mm-wave bands and the RF loss in fundamental elements such as switches is becoming even more critical. Many commercially available switch technologies have certain issues with at least one of the following: resistive load, capacitive interference, limited bandwidth, low power operation, and/or nonlinearity. Recent work on emerging chalcogenide phase change material (PCM)-based switches has demonstrated a breakthrough innovation and a new class of reconfigurable devices exhibiting high performance, better monolithic and heterogeneous integration capabilities with other switch technologies, exceptional figure of merit, and broadband RF response compared to various commercially available switch technologies. Along with PCMs, metal-insulator transition (MIT) material such as vanadium dioxide based devices have also gained significant interest and researchers around the globe have demonstrated various interesting applications using PCM/MIT including but not limited to tunable mm-wave components, reconfigurable electro-optical components, and resonant sensors. Several research groups and industries are working to mature these technologies for high performance and efficient future wireless systems. This workshop aims to trigger the discussion on emerging PCM/MIT technologies regarding recent innovations, challenges, integration possibilities, limitations, and future trends.
Technical Papers
Abstract
WMC-1: Chalcogenide-Based Phase-Change Material RF Switches: Fundamentals, Design Considerations, and Circuit/System Applications
Nabil El-Hinnawy
Nabil El-Hinnawy, Tower Partners Semiconductor Company
Tower Partners Semiconductor Company
(08:00 - 17:00)
Materials
workshops-2022/WMC_1.pdf
Abstract
WMC-2: Phase Change Materials (PCM) Switches and their Microwave and mm-Wave Applications
Raafat R. Mansour
Raafat R. Mansour, Univ. of Waterloo
Univ. of Waterloo
(08:00 - 17:00)
Materials
workshops-2022/WMC_2.pdf
Abstract
WMC-3: Design and Optimization of Phase Change Material-Based Switches and Circuits
Pierre Blondy
Pierre Blondy, XLIM (UMR 7252)
XLIM (UMR 7252)
(08:00 - 17:00)
Materials
workshops-2022/WMC_3.pdf
Abstract
WMC-4: Robust SbTe-Based Phase Change RF Switch Technology
Jeong-sun Moon
Jeong-sun Moon, HRL Laboratories
HRL Laboratories
(08:00 - 17:00)
Materials
workshops-2022/WMC_4.pdf
Abstract
WMC-5: Spiking and Resonant RF Sensors Based on Vanadium Dioxide
Adrian Mahai Ionescu
Adrian Mahai Ionescu, EPFL
EPFL
(08:00 - 17:00)
Materials
workshops-2022/WMC_5.pdf
Abstract
WMC-6: TaOx Resistive Switching Phenomena; Physical Properties and Device Applications
Robin B. Jacobs-Gedrim
Robin B. Jacobs-Gedrim, Sandia National Laboratories
Sandia National Laboratories
(08:00 - 17:00)
Materials
workshops-2022/WMC_6.pdf
Abstract
WMC-7: Vanadium Dioxide for Reconfigurable Antennas and Microwave Devices: Enabling RF Reconfigurability Through Smart Materials
Dimitris E. Anagnostou
Dimitris E. Anagnostou, Heriot-Watt Univ.
Heriot-Watt Univ.
(08:00 - 17:00)
Materials
workshops-2022/WMC_7.pdf
Abstract
WMC-8: Phase Change Electro-Optical Components
Mina Rais-Zadeh
Mina Rais-Zadeh, Jet Propulsion Lab
Jet Propulsion Lab
(08:00 - 17:00)
Materials
workshops-2022/WMC_8.pdf
Kevin Xiaoxiong Gu, Kamal Samanta
Metawave, Sony
201/203
Abstract
Research and development on mm-wave front-end implementations are expanding to a new frontier beyond 100GHz for emerging 6G communication and radar imaging applications. This proposed workshop covers the latest advancement of packaging and integration technologies for designing and implementing >100GHz front-end modules including in-depth discussions of different substrates, interconnects, antennas, co-design with RFICs, thermal management, system demos/prototypes, and so on. We plan to have 11 experts (5 from university/research institutes; 6 from industry) to present their pioneering works in this area: (1) Prof. Mark Rodwell from UCSB and Director of the SRC/DARPA ComSenTer Wireless Research Center, (2) Dr. Muhammad Furqan from Infineon, (3) Siddhartha Sinha from imec, (4) Dr. Telesphor Kamgaing from Intel, (5) Dr. Alberto Valdes-Garcia from IBM Research, (6) Prof. Wolfgang Heinrich from the Ferdinand-Braun-Institut (FBH), (7) Dr. Augusto Gutierrez-Aitken from Northrop Grumman, (8) Dr. Jon Hacker from Teledyne, (9) Dr. Goutam Chattopadhyay from NASA JPL, (10) Prof. Emmanouil (Manos) M. Tentzeris from Georgia Tech, and (11) Dr. Venkatesh Srinivasan from Texas Instruments.
Technical Papers
Abstract
WMD-1: 140, 210, and 280GHz IC and Transceiver Module Design
Mark Rodwell
Mark Rodwell, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:00)
Materials
workshops-2022/WMD_1.pdf
Abstract
WMD-3: Hetero-Integration as a Key Enabler for Sub-THz Radar and Communication Systems
Siddhartha Sinha
Siddhartha Sinha, IMEC
IMEC
(08:00 - 17:00)
Materials
workshops-2022/WMD_3.pdf
Abstract
WMD-4: Silicon and Organic Packaging Integration for mm-Wave and Sub-THz Communications
Telesphor Kamgaing
Telesphor Kamgaing, Intel
Intel
(08:00 - 17:00)
Materials
workshops-2022/WMD_4.pdf
Abstract
WMD-5: Scaled W-Band Phased Array Module Design and Integration for Real-Time 3D Radar Imaging
Alberto Valdes-Garcia
Alberto Valdes-Garcia, IBM
IBM
(08:00 - 17:00)
Materials
workshops-2022/WMD_5.pdf
Abstract
WMD-6: InP-on-BiCMOS Hetero-Integration for 100GHz and Beyond
Wolfgang Heinrich
Wolfgang Heinrich, FBH
FBH
(08:00 - 17:00)
Materials
workshops-2022/WMD_6.pdf
Abstract
WMD-7: Heterogeneous Integration for High Frequency RF Applications
Augusto Gutierrez-Aitken
Augusto Gutierrez-Aitken, Northrop Grumman
Northrop Grumman
(08:00 - 17:00)
Materials
workshops-2022/WMD_7.pdf
Abstract
WMD-8: Wafer-Scale mm-Wave Integration Techniques for Phased Arrays
Jon Hacker
Jon Hacker, Teledyne Scientific & Imaging
Teledyne Scientific & Imaging
(08:00 - 17:00)
Materials
workshops-2022/WMD_8.pdf
Abstract
WMD-9: Integration and Packaging for Systems at mm-Wave and THz Frequencies
Goutam Chattopadhyay
Goutam Chattopadhyay, Jet Propulsion Lab
Jet Propulsion Lab
(08:00 - 17:00)
Materials
workshops-2022/WMD_9.pdf
Abstract
WMD-10: Additively manufactured Reconfigurable Intelligent Surfaces for B5G/6G Sub-GHz Applications
Manos M. Tentzeris
Manos M. Tentzeris, Georgia Tech
Georgia Tech
(08:00 - 17:00)
Materials
workshops-2022/WMD_10.pdf
Abstract
WMD-11: Package Design at mm-Wave Frequencies for Radar Transceivers: Challenges and Opportunities
Venkatesh Srinivasan
Venkatesh Srinivasan, Texas Instruments
Texas Instruments
(08:00 - 17:00)
Materials
workshops-2022/WMD_11.pdf
Kenneth E. Kolodziej, Timothy M. Hancock
MIT Lincoln Laboratory, DARPA
205/207
Abstract
Many wireless systems could benefit from the ability to transmit and receive on the same frequency at the same time, which is known as in-band full-duplex (IBFD) and/or simultaneous transmit and receive (STAR). As this area matures, research is shifting towards reducing device form factors and creating novel self-interference cancellation techniques along with completely-integrated IBFD transceivers. In this workshop, experts from industry, academic and federal research institutions will discuss the various approaches that can be taken to construct IBFD systems and devices in an integrated fashion. Additionally, a mini-panel session is planned where the workshop speakers will debate the answers to questions posed by attendees for an interactive discussion with the audience.
Technical Papers
Abstract
WME-1: In-Band Full-Duplex Overview and Integration Challenges
Kenneth E. Kolodziej, Timothy M. Hancock
Kenneth E. Kolodziej, MIT Lincoln Laboratory, Timothy M. Hancock, DARPA
MIT Lincoln Laboratory, DARPA
(08:00 - 17:00)
Materials
workshops-2022/WME_1.pdf
Abstract
WME-2: Disaggregated Platform-Based Approach for In-Band Full Duplex Systems
Mayank Jain, Aditya Agrawal
Mayank Jain, Kumu Networks, Aditya Agrawal, Kumu Networks
Kumu Networks, Kumu Networks
(08:00 - 17:00)
Materials
workshops-2022/WME_2.pdf
Abstract
WME-3: Applications of Code-Domain Signal Processing for Full-Duplex Radio
James F. Buckwalter
James F. Buckwalter, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara
(08:00 - 17:00)
Materials
workshops-2022/WME_3.pdf
Abstract
WME-4: Hybrid Time-Domain/Frequency-Domain Self-Interference Cancellation for STAR Applications
Mark Hickle
Mark Hickle, BAE Systems
BAE Systems
(08:00 - 17:00)
Materials
workshops-2022/WME_4.pdf
Abstract
WME-5: In-Band, Full-Duplex Self-Interference Mitigation Under Realistic Hardware Constraints
Alyosha C. Molnar, David G. Landon, Daniel W. Bliss
Alyosha C. Molnar, Cornell Univ., David G. Landon, L3Harris, Daniel W. Bliss, Arizona State Univ.
Cornell Univ., L3Harris, Arizona State Univ.
(08:00 - 17:00)
Materials
workshops-2022/WME_5.pdf
Abstract
WME-6: Wideband Photonic-Acoustic Assisted Self-Interference Cancellation for Full-Duplex Transceivers
Firooz Aflatouni
Firooz Aflatouni, Univ. of Pennsylvania
Univ. of Pennsylvania
(08:00 - 17:00)
Materials
workshops-2022/WME_6.pdf
Abstract
WME-7: Revolutionizing STAR Transceivers through Electric + Acoustic SIC
Harish Krishnaswamy
Harish Krishnaswamy, Columbia Univ.
Columbia Univ.
(08:00 - 17:00)
Materials
workshops-2022/WME_7.pdf
Abstract
WME-8: MMIC Components for Broadband STAR Arrays
Laila Marzall
Laila Marzall, University of Colorado Boulder
University of Colorado Boulder
(08:00 - 17:00)
Materials
workshops-2022/WME_8.pdf
Abstract
WME-9: GHz to Sub-THz In-Band Full-Duplex Operations in CMOS Based on Wave Frequency and Mode Conversions
Ruonan Han
Ruonan Han, MIT
MIT
(08:00 - 17:00)
Materials
workshops-2022/WME_9.pdf
Joseph Bardin, Fabio Sebastiano
Google, Technische Universiteit Delft
401-402
Abstract
Microwave techniques are central to many modern quantum computing and quantum sensing platforms, ranging from those implemented with superconducting circuits to those relying on trapped ions. For instance, in superconducting technologies, qubits are implemented using nonlinear microwave resonators — which sometimes are frequency tunable — and coupling between qubits is often mediated using tunable LC filter networks. The state of a superconducting quantum processor is controlled using microwave signaling and measured using microwave reflectometry. Similarly, spin-qubit and trapped-ion systems often rely heavily on microwave signaling for their operation. As the culmination of decades of research, quantum computers can now perform certain classes of computations that are impractical using classical supercomputers. While today’s quantum computers have largely been enabled by advances in commercial microwave technology, the quest to build these machines has also led to pioneering research that has pushed the limits of microwave amplification, packaging, filtering, and system design. In this workshop, leading researchers will describe progress in microwave technologies as applied to quantum computing and quantum sensing. The workshop is both broad and deep, covering microwave technologies that are used across the quantum computing landscape. At the high level, researchers will describe how microwave techniques are used to control superconducting, spin, and trapped-ion based quantum processors, covering a wide array of topics ranging from how microwave fields can be used in the trapping and manipulation of single ions to modular and SoC-based control systems for next-generation superconducting and spin qubit based quantum computers. The workshop will also contain deep dives into areas such as the systematic design of near-quantum-limited microwave parametric amplifiers, superconducting interconnect and filtering networks, system level quantum-coherent microwave packaging techniques, the cryogenic noise limits of semiconductor amplifiers, and quantum sensor systems leveraging microwave techniques. Central to all talks is the connection between microwave technology and the quantum information sciences.
Technical Papers
Abstract
WMF-1: Microwave and RF Techniques in Trapped Ion Quantum Computing
Daniel Slichter
Daniel Slichter, NIST
NIST
(08:00 - 17:00)
Materials
workshops-2022/WMF_2.pdf
Abstract
WMF-2: Design of Microwave Control Systems for Emerging NISQ-Scale Quantum Computers
Glenn Jones
Glenn Jones, Rigetti Computing
Rigetti Computing
(08:00 - 17:00)
Abstract
WMF-3: Systematic Design of Microwave Parametric Amplifiers, Frequency Converters, and Circulators
Ofer Naaman
Ofer Naaman, Google
Google
(08:00 - 17:00)
Materials
workshops-2022/WMF_3.pdf
Abstract
WMF-4: A Fully Integrated Cryo-CMOS SoC for a Scalable Quantum Computer Implemented in Intel 22nm FFL FinFET Process
Sushil Subramanian
Sushil Subramanian, Intel Corp.
Intel Corp.
(08:00 - 17:00)
Materials
workshops-2022/WMF_4.pdf
Abstract
WMF-5: WITHDRAWN - Quantum I/O for the KQbit Era: Integrating Cryogenic Microwave Components in a Flexible Stripline
Kiefer James Vermeulen
Kiefer James Vermeulen, Delft Circuits
Delft Circuits
(08:00 - 17:00)
Abstract
WMF-6: 3D Integration and Cryogenic Packaging for Superconducting Qubits
Mollie Schwartz
Mollie Schwartz, MIT Lincoln Laboratory
MIT Lincoln Laboratory
(08:00 - 17:00)
Abstract
WMF-7: Microwave Readout of Solid-State Quantum Sensors
David Phillips
David Phillips, Massachusetts Institute of Technology
Massachusetts Institute of Technology
(08:00 - 17:00)
Materials
workshops-2022/WMF_7.pdf
Abstract
WMF-8: Towards the Lower Limits of Microwave Noise in HEMTs: Self-Heating and Real-Space Transfer
Austin Minnich
Austin Minnich, Caltech
Caltech
(08:00 - 17:00)
Materials
workshops-2022/WMF_8.pdf
Roberto Quaglia, Olof Bengtsson
Cardiff University, FBH
403-404
Abstract
Power amplifiers for high frequency applications can benefit greatly from the ability to dynamically vary the supply voltage. For example, when spectral efficient signals are used, their large amplitude dynamic generally requires a compromise between linearity and efficiency of the amplifier, leading to poor average efficiency. By applying supply modulation in the form of envelope tracking, the average efficiency can be enhanced significantly. The introduction of GaN technology has enabled highly efficient very fast switch-based supply modulators that are required for the very large instantaneous bandwidth in telecommunication for space and the future 5G systems. With the introductions of 5G the system frequency increase and power per PA is reduced by distributed PA solutions like MIMO. The same is true for space applications but here, the main motivation for the development of efficient solid-state solutions is the transfer from bulky tube based solutions. The large instantaneous bandwidth of the future telecom systems poses a challenge for dynamic supply modulation but the high frequency and reduced power allows for novel integrated solutions with reduced parasitic effects where the modulator and RFPA are integrated on the same chip. This workshop will: introduce the motivations and applications of supply modulation technologies for space and terrestrial telecommunication; discuss how RF transistor technologies affect the requirements of the supply modulator and the effectiveness of supply modulation; show advanced design techniques for the supply modulator and the integration with RF amplifier; present system level solutions including linearization of supply modulation-based amplifier systems. Moreover, two expert talks on supply modulation for dynamic power control in high power ISM systems is also considered and optimized, compact envelope tracking for 3D printers will enable cross-fertilization with fields adjacent to the microwave industry and permit a fruitful exchange of ideas.    

The organizer’s aim is to actively involve the audience in the discussion, in order to provide them with a useful experience. For this reason, an online quiz will involve the audience with questions that can be answered only by interacting with the speakers.
Technical Papers
Abstract
WMG-1: Supply modulated PAs: promises and challenges
Roberto Quaglia, Olof Bengtsson
Roberto Quaglia, Cardiff University
Cardiff University, Cardiff University
(08:00 - 17:00)
Materials
workshops-2022/WMG_1.pdf
Abstract
WMG-2: Supply-Modulated Power Amplifier Systems for 5G and Space
Olof Bengtsson, Sophie Paul, Christoph Schulze, Nikolai Wolff
Olof Bengtsson, FBH
FBH, FBH, FBH, FBH
(08:00 - 17:00)
Materials
workshops-2022/WMG_2.pdf
Abstract
WMG-3: Supply Modulation Techniques for High PAPR Signals
Gregor Lasser, Maxwell Duffy, Connor Nogales, Paul Flaten, Zoya Popovic
Gregor Lasser, Ferdinand-Braun-Institut
Ferdinand-Braun-Institut, Northrop Grumman, University of Colorado Boulder, Northrop Grumman, Univ. of Colorado
(08:00 - 17:00)
Materials
workshops-2022/WMG_3.pdf
Abstract
WMG-4: Linearization Techniques for Wideband Envelope Tracking Systems for Handsets
Pere Gilabert, Wantao Li, Gabriel Montoro
Pere Gilabert, Univ. Politècnica de Catalunya
Univ. Politècnica de Catalunya, Univ. Politècnica de Catalunya, Univ. Politècnica de Catalunya
(08:00 - 17:00)
Materials
workshops-2022/WMG_4.pdf
Abstract
WMG-5: Assessing High Frequency Transistor Technologies for Envelope Tracking Systems
Alexander Alt, Jonathan Lees, Peng Chen, Paul Tasker
Alexander Alt, Cardiff University
Cardiff University, Cardiff University, Cardiff University, Cardiff University
(08:00 - 17:00)
Materials
workshops-2022/WMG_5.pdf
WMG-6: 8-Level Envelope-Tracking with Power-DAC and RF Amplifier Architectures
Tommaso Cappello, Zoya Popovic
Tommaso Cappello, Univ. of Bristol
Univ. of Bristol, Univ. of Colorado
(08:00 - 17:00)
Materials
workshops-2022/WMG_6.pdf
Abstract
WMG-7: Fast DC/DC Modulator Using a Single Stage Buck Converter
Riccardo Tinivella
Riccardo Tinivella, Brusa Elektronik
Brusa Elektronik
(08:00 - 17:00)
Materials
workshops-2022/WMG_7.pdf
Abstract
WMG-8: Design Considerations for High Power VHF Amplifiers for Transient and Dynamic Loads
Florian Maier
Florian Maier, TRUMPF Hüttinger
TRUMPF Hüttinger
(08:00 - 17:00)
Materials
workshops-2022/WMG_8.pdf
Ko-Tao Lee, Guillaume Callet
Qorvo, UMS
503-504
Abstract
Recent advances of the GaN/GaAs technology development have enabled RF module switching at extremely high frequency that Si devices cannot withstand. It has shaped the landscape of RF industry and enabled applications in mm-wave frequency bands. In this full-day workshop, 9 talks will be presented from highly-recognized industrial leaders and technical experts across the globe. It covers the the major breakthrough from the latest development of GaN/GaAs technology and integration, including 1) heterogeneous integration of GaN/GaAs MMIC, 2) exploratory RF devices for mm-wave, and 3) systems and use-cases of GaN/GaAs technologies. At the closing of the day, an interactive panel session will be conducted between speakers and audiences. It is expected that the workshop can provide a platform for the latest mm-wave technology breakthroughs and a forum to share views.
Technical Papers
Abstract
WMI-1: Emerging mm-Wave Device and Integration Technology — Next Generation GaN and Beyond
Thomas Kazior
Thomas Kazior, DARPA
DARPA
(08:00 - 17:00)
Materials
workshops-2022/WMI_1.pdf
Abstract
WMI-2: mm-Wave Scalable Unconstrained Broadband Arrays (MMW SCUBA)
Ryan Walsh
Ryan Walsh, Northrop Grumman
Northrop Grumman
(08:00 - 17:00)
Materials
workshops-2022/WMI_2.pdf
Abstract
WMI-3: Advanced Interconnects for Heterogeneous Integration of GaN and GaAs RF MMICs
Deep Dumka
Deep Dumka, Qorvo
Qorvo
(08:00 - 17:00)
Materials
workshops-2022/WMI_3.pdf
Abstract
WMI-4: mm-Wave GaN MMICs for 5G and Satellite Communication Systems
Koji Yamanaka
Koji Yamanaka, Mitsubishi Electric
Mitsubishi Electric
(08:00 - 17:00)
Materials
workshops-2022/WMI_4.pdf
Abstract
WMI-5: MMIC and Integration Technologies for Best-In-Class mm-Wave Component Solutions from 24GHz up to E-Band
Laurent Marechal
Laurent Marechal, UMS
UMS
(08:00 - 17:00)
Materials
workshops-2022/WMI_5.pdf
Abstract
WMI-6: Compound Technologies Advancement for mm-Wave Applications — from a Commercial Foundry Perspective
Barry Lin
Barry Lin, Wavetek
Wavetek
(08:00 - 17:00)
Materials
workshops-2022/WMI_6.pdf
Abstract
WMI-7: Research and Development of GaN-Based HEMTs for mm-Wave and THz Wireless Communications
Issei Watanabe
Issei Watanabe, NICT
NICT
(08:00 - 17:00)
Materials
workshops-2022/WMI_7.pdf
Abstract
WMI-8: GaN Integration in FOWLP
Michael Pretl
Michael Pretl, Rohde & Schwarz
Rohde & Schwarz
(08:00 - 17:00)
Materials
workshops-2022/WMI_8.pdf
Abstract
WMI-9: Integrated Compound Semiconductor Circuits — a 6G Communications Systems Perspective
Kristoffer Andersson
Kristoffer Andersson, Ericsson
Ericsson
(08:00 - 17:00)
Materials
workshops-2022/WMI_9.pdf
Xiaobang Shang, Nick Ridler, Jian Ding, Andy Tucker
NPL, Spirit Semiconductor, Filtronic Broadband Ltd.
605/607
Abstract
Accurate on-wafer S-parameter measurement plays an important role in the development of mm-wave integrated circuits for communications and electronics applications. To this end, a group of international experts in this field will share their experience on making reliable on-wafer measurements at high frequencies (eg above 100GHz). The presenters come from different backgrounds — instrumentation manufacturers, metrology institutes, end-users in industry and academia — and so provide different perspectives on this topic. The emphasis of the workshop is on sharing practical tips (ie good practice) so that attendees can subsequently implement such methods in their own workplaces. The workshop will cover topics including calibration techniques, verification methods, guides on design of custom calibration standards, instrumentation, and applications, etc. The workshop includes two panel discussions: (i) an open discussion about the challenges/opportunities/outlooks for research into on-wafer measurements in coming years; and (ii) an opportunity for attendees to describe their own on-wafer measurement problems so that these can be discussed, and hopefully solved, during the workshop.
Technical Papers
Abstract
WMK-1: Review of Calibration Techniques for On-Wafer Measurements at mm-Wave Frequencies
Xiaobang Shang, Nick Ridler
Xiaobang Shang, NPL, Nick Ridler, NPL
NPL, NPL
(08:00 - 17:00)
Materials
workshops-2022/WMK_1.pdf
Abstract
WMK-2: Wafer-Level RF Measurement System Integrity: How to Verify and When and Why we have to do it
Andrej Rumiantsev, Ralf Doerner
Andrej Rumiantsev, MPI, Ralf Doerner, FBH
MPI, FBH
(08:00 - 17:00)
Materials
workshops-2022/WMK_2.pdf
Abstract
WMK-3: Guidelines for Performing Accurate On-Wafer Measurements Including the Suppression of Parasitic Effects
Uwe Arz, Gia Ngoc Phung
Uwe Arz, PTB, Gia Ngoc Phung, PTB
PTB, PTB
(08:00 - 17:00)
Materials
workshops-2022/WMK_3.pdf
Abstract
WMK-4: Modeling and Correction of Probe-Probe Crosstalk at mm-Wave Frequencies
Chong Li
Chong Li, Univ. of Glasgow
Univ. of Glasgow
(08:00 - 17:00)
Materials
workshops-2022/WMK_4.pdf
Abstract
WMK-5: Open Discussion 1: On-Wafer Measurement: Challenges and Opportunities for the Future
(08:00 - 17:00)
Abstract
WMK-6: Instrumentation Aspects of mm-Wave On-Wafer Measurements
Jon Martens
Jon Martens, Anritsu
Anritsu
(08:00 - 17:00)
Materials
workshops-2022/WMK_6.pdf
Abstract
WMK-7: Broadband RF to mm-Wave S-Parameter Measurements for Semiconductor Transistor and IC Test
Gavin Fisher, Anthony Lord
Gavin Fisher, FormFactor
FormFactor, FormFactor
(08:00 - 17:00)
Materials
workshops-2022/WMK_7.pdf
Abstract
WMK-8: On-Wafer Measurements and Calibration at Sub-mm-Wave Frequencies Using Micromachined Probes
Robert M. Weikle, Matthew F. Bauwens, Michael E. Cyberey, Linli Xie, N. Scott Barker, Arthur W. Lichtenberger
Robert M. Weikle, Univ. of Virginia, Linli Xie, Univ. of Virginia
Univ. of Virginia, Dominion Microprobes, Univ. of Virginia, Univ. of Virginia, Univ. of Virginia, Univ. of Virginia
(08:00 - 17:00)
Materials
workshops-2022/WMK_8.pdf
Abstract
WMK-9: Combined mm-Waves and Nanorobotics for Traceable Electronics Technology
Kamel Haddadi
Kamel Haddadi, IEMN (UMR 8520)
IEMN (UMR 8520)
(08:00 - 17:00)
Materials
workshops-2022/WMK_9.pdf
Abstract
WMK-10: Open Discussion 2: Bring Your Own Measurement Problem
(08:00 - 17:00)
Nicholas Miller, Sourabh Khandelwal
AFRL, Macquarie Univ.
702/704/ 706
Abstract
Gallium nitride (GaN) high electron mobility transistors (HEMTs) are an excellent technology for various microwave power amplifier applications due to the underlying semiconductor’s wide bandgap, high breakdown voltage and large peak electron velocity. A key bottleneck to the technology’s widespread and long-term adoption into commercial and military applications is its inherent electrical reliability. The physical mechanisms of GaN HEMT electrical degradation are largely unresolved and actively under investigation. In this full-day workshop, international experts in the fields of microwave measurements, trap characterization, thermal characterization, GaN HEMT nonlinear modeling, trap modeling, and TCAD modeling will present state-of-the-art research. 

This interactive workshop aims to inform and excite the attendees on the advances in multiple aspects of this technology. Starting with a GaN technology overview, the planned talks will inform the audience into measurement and characterization of this technology including the charge trapping and thermal properties in these devices. Next part of the workshop covers the modeling and simulation research in GaN. Starting with an overview of modeling challenges in GaN devices, the workshop will cover the latest industry standard compact models and advances in TCAD-based modeling of GaN devices. 
Technical Papers
Abstract
WML-1: The History of GaN electronics: A perspective
Umesh Mishra, Matthew Guidry
Umesh Mishra, Univ. of California, Santa Barbara
Univ. of California, Santa Barbara, Univ. of California, Santa Barbara
(08:00 - 17:00)
Materials
workshops-2022/WML_1.pdf
Abstract
WML-2: Measuring GaN HEMT Performance Degradation Under Nonlinear Dynamic Operation
Valeria Vadalà
Valeria Vadalà, Università di Milano-Bicocca
Università di Milano-Bicocca
(08:00 - 17:00)
Materials
workshops-2022/WML_2.pdf
Abstract
WML-3: Experimental Characterization of Charge Trapping in GaN HEMTs using LF and RF Measurement Techniques
Gian Piero Gibiino, Alberto Maria Angelotti
Gian Piero Gibiino, Univ. of Bologna, Alberto Maria Angelotti, Univ. of Bologna
Univ. of Bologna, Univ. of Bologna
(08:00 - 17:00)
Materials
workshops-2022/WML_3.pdf
Abstract
WML-4: Low Frequency Active Harmonic Load-Pull for Experimental Verification of Power Amplifiers’ Modes
Patrick Roblin, J. Apolinar Reynoso-Hernandez, Marlon Molina Ceseña
Patrick Roblin, Ohio State Univ., J. Apolinar Reynoso-Hernandez, CICESE
Ohio State Univ., CICESE, CICESE
(08:00 - 17:00)
Materials
workshops-2022/WML_4.pdf
Abstract
WML-5: Advanced Thermal Characterization of GaN Devices, From Micro to Nanoscale, and New Heating Sinking Solutions
Paul Hayes, Martin Kuball
Paul Hayes, QFI Corporation, Martin Kuball, Univ. of Bristol
QFI Corporation, Univ. of Bristol
(08:00 - 17:00)
Materials
workshops-2022/WML_5.pdf
Abstract
WML-6: Overview and Challenges of Modeling Microwave and mm-Wave GaN HEMT Technologies
Rob Jones
Rob Jones, BAE Systems
BAE Systems
(08:00 - 17:00)
Materials
workshops-2022/WML_6.pdf
Abstract
WML-7: Device and Circuit Co-Design Using MVSG Modeling Framework
Ujwal Radhakrishna
Ujwal Radhakrishna, Texas Instruments
Texas Instruments
(08:00 - 17:00)
Materials
workshops-2022/WML_7.pdf
Abstract
WML-8: Scalable Nonlinear RF Modeling of GaN HEMTs with Industry Standard ASM HEMT Compact Model
Sourabh Khandelwal
Sourabh Khandelwal, Macquarie Univ.
Macquarie Univ.
(08:00 - 17:00)
Materials
workshops-2022/WML_8.pdf
Abstract
WML-9: Nonlinear RF modeling of GaN HEMTs with Fermi kinetics transport and the ASM-HEMT compact model
Nicholas Miller, Matt Grupen
Nicholas Miller, AFRL
AFRL, AFRL
(08:00 - 17:00)
Materials
workshops-2022/WML_9.pdf
Abstract
WML-10: Prediction by Technology Computer Aided Design of the Large Signal GaN HFET Performance
Christos Zervos, Dan Ritter
Dan Ritter, Technion, Christos Zervos, Technion - Israel Institute of Technology
Technion - Israel Institute of Technology, Technion
(08:00 - 17:00)
Materials
workshops-2022/WML_10.pdf
Abstract
WML-11: Physics-Based Large-Signal and Trap Modeling of GaN HEMTs
Petros Beleniotis, Matthias Rudolph
Petros Beleniotis, Brandenburg Univ. of Technology, Matthias Rudolph, BTU
Brandenburg Univ. of Technology, BTU
(08:00 - 17:00)
Materials
workshops-2022/WML_11.pdf

-

Hongtao Xu
Fudan Univ.
Qun Jane Gu
Univ. of California, Davis
1A-1C
Abstract
This session presents five papers focusing on mm-wave transceivers and modules for point-to-point and emerging applications. The session starts with an all-silicon E-band Backhaul-on-Glass frequency division duplex module demonstrating up to 24Gb/s data rate and >23dBm Pout. The second paper demonstrates an actively tunable V-band reflective surface for blockage mitigation. The third paper presents V-band phased array transceiver chip sets with harmonic rejection mixer based frequency interleaving for channel aggregation. The last two papers demonstrate D-band links with data rates of 17Gb/s and 56.32Gb/s respectively.
Technical Papers
Abstract
RMo2A-1: An All-Silicon E-Band Backhaul-on-Glass Frequency Division Duplex Module with >24dBm PSAT & 8dB NF
Shahriar Shahramian, Michael Holyoak, Mike Zierdt, Joe Weiner, Amit Singh, Yves Baeyens
Shahriar Shahramian, Nokia Bell Labs
Nokia Bell Labs, Nokia Bell Labs, Nokia Bell Labs, Nokia Bell Labs, Nokia Bell Labs, Nokia Bell Labs
(10:10 - 10:30)
Abstract
RMo2A-2: Active Tunable Millimeter-Wave Reflective Surface Across 57–64GHz for Blockage Mitigation and Physical Layer Security
Suresh Venkatesh, Hooman Saeidi, Xuyang Lu, Kaushik Sengupta
Suresh Venkatesh, Princeton Univ.
Princeton Univ., Princeton Univ., UM-SJTU Joint Institute, Princeton Univ.
(10:30 - 10:50)
Abstract
RMo2A-3: A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving
Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, Arun Natarajan, Harish Krishnaswamy
Armagan Dascurcu, Columbia Univ.
Columbia Univ., Columbia Univ., Columbia Univ., Oregon State Univ., Oregon State Univ., Columbia Univ.
(10:50 - 11:10)
Abstract
RMo2A-4: A 17Gb/s 10.7pJ/b 4FSK Transceiver System for Point to Point Communication in 65nm CMOS
Hamidreza Afzal, Cheng Li, Omeed Momeni
Hamidreza Afzal, Univ. of California, Davis
Univ. of California, Davis, Univ. of California, Davis, Univ. of California, Davis
(11:10 - 11:30)
Abstract
RMo2A-5: A 56.32Gb/s 16-QAM D-Band Wireless Link Using RX-TX Systems-in-Package with Integrated Multi-LO Generators in 45nm RFSOI
Abdelaziz Hamani, Francesco Foglia Manzillo, Alexandre Siligaris, Nicolas Cassiau, Frederic Hameau, Fabrice Chaix, Cedric Dehos, Antonio Clemente, José Luis Gonzalez-Jimenez
Abdelaziz Hamani, CEA-LETI
CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI, CEA-LETI
(11:30 - 11:50)
Alyssa Apsel
Cornell Univ.
Domine Leenaerts
NXP Semiconductors
1D-1F
Abstract
The first two papers address innovations in power switches up to 120GHz. The next two papers discusses high frequency techniques for CMOS-based amplifiers. The last paper of this session focuses on a power divider for the 5G frequency bands.
Technical Papers
Abstract
RMo2B-1: A DC-to-18GHz SP10T RF Switch Using Symmetrically-Routed Series-TL-Shunt and Reconfigurable Single-Pole Network Topologies Presenting 1.1-to-3.2dB IL in 0.15µm GaAs pHEMT
Zhaowu Wang, Zhenyu Wang, Tao Yang, Yong Wang
Xiaochen Tang, New Mexico State Univ.
UESTC, UESTC, UESTC, UESTC
(10:10 - 10:30)
Abstract
RMo2B-2: A DC–120GHz SPDT Switch Based on 22nm FD-SOI SLVT NFETs with Substrate Isolation Rings Towards Increased Shunt Impedance
M. Rack, L. Nyssens, Q. Courte, D. Lederer, J.-P. Raskin
M. Rack, Université catholique de Louvain
Université catholique de Louvain, Université catholique de Louvain, Université catholique de Louvain, Université catholique de Louvain, Université catholique de Louvain
(10:30 - 10:50)
Abstract
RMo2B-3: Analysis and Design of Dual-Peak Gmax-Core CMOS Amplifier in D-Band Embedding a T-Shaped Network
Jiseul Kim, Chan-Gyu Choi, Kangseop Lee, Kyunghwan Kim, Seung-Uk Choi, Ho-Jin Song
Jiseul Kim, POSTECH
POSTECH, POSTECH, POSTECH, POSTECH, POSTECH, POSTECH
(10:50 - 11:10)
Abstract
RMo2B-4: 280.2/309.2GHz, 18.2/9.3dB Gain, 1.48/1.4dB Gain-per-mW, 3-Stage Amplifiers in 65nm CMOS Adopting Double-Embedded-Gmax-Core
Byeonghun Yun, Dae-Woong Park, Chan-Gyu Choi, Ho-Jin Song, Sang-Gug Lee
Byeonghun Yun, KAIST
KAIST, Kumoh National Institute of Technology, POSTECH, POSTECH, KAIST
(11:10 - 11:30)
Abstract
RMo2B-5: 4-Way 0.031mm² Switchable Bidirectional Power Divider for 5G mm-Wave Beamformers
Aniello Franzese, Renato Negra, Andrea Malignaggi
Aniello Franzese, IHP
IHP, RWTH Aachen Univ., IHP
(11:30 - 11:50)
Debopriyo Chowdhury
Broadcom
Margaret Szymanowski
Crane Aerospace & Electronics
4A-4C
Abstract
This session will present digital, phased array and RF beamforming transmitters for radar, inter-satellite and communication applications. The session starts with a 4–9GHz UWB transmitter, followed by mm-wave transmitters with high efficiency.
Technical Papers
Abstract
RMo2C-1: A 4-to-9GHz IEEE 802.15.4z-Compliant UWB Digital Transmitter with Reconfigurable Pulse-Shaping in 28nm CMOS
Hua Chen, Zhenqi Chen, Rongde Ou, Run Chen, Zhaohui Wu, Bin Li
Shiyu Su, Univ. of Southern California
SCUT, NewRadio Technology, NewRadio Technology, NewRadio Technology, SCUT, SCUT
(10:10 - 10:30)
Abstract
RMo2C-2: A 23GHz RF-Beamforming Transmitter with >15.5dBm Psat and >21.7% Peak Efficiency for Inter-Satellite Communications
Kaijie Ding, Dusan Milosevic, Vojkan Vidojkovic, Rainier van Dommele, Mark Bentum, Peter Baltus
Hao Gao, Eindhoven Univ. of Technology
Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven, Technische Universiteit Eindhoven
(10:30 - 10:50)
Abstract
RMo2C-3: A Quadrature-Rotation Phased-Array Transmitter with 15-Bit Phase Tuning and 0/3/6/9/12/15-dB PBOs Efficiency Enhancement
Jie Zhou, Huizhen Jenny Qian, Bingzheng Yang, Xun Luo
Yilong Zhu, Univ. of Electronic Science and Technology of China
UESTC, UESTC, UESTC, UESTC
(10:50 - 11:10)
Abstract
RMo2C-4: An E-Band CMOS Direct Conversion IQ Transmitter for Radar and Communication Applications
Seunghoon Lee, Kyunghwan Kim, Kangseop Lee, Sungmin Cho, Seung-Uk Choi, Jayol Lee, Bontae Koo, Ho-Jin Song
Seunghoon Lee, POSTECH
POSTECH, POSTECH, POSTECH, POSTECH, POSTECH, ETRI, ETRI, POSTECH
(11:10 - 11:30)

-

Hossein Hashemi, Oren Eliezer
Univ. of Southern California, Ambiq Micro
2C
Abstract
This panel debates the roles of academia and industry in shaping the future of RFIC design. Given the increased complexity of modern RF integrated systems and the need for well trained RFIC engineers, the panel raises the question of who should lead RFIC research. If the industry is to take the lead, what is the role of universities and who should pay for training graduate students?  Should academics move to other research domains?  What should be done to prevent them from being lured away from universities and into financially rewarding industry careers?  Are there fundamental RFIC research challenges that academics can still tackle for the next generation RF systems given the increasing complexities in design and fabrication of advanced RFICs?

The panel, formed of industry experts, university professors and those who crossed the line between academic and industry careers, will look at past, current and future RFIC research, education, and support models with the audience's participation.

Slido App link:
https://app.sli.do/event/crxy81NUPQUxgJstrTgAiW/live/questions
Abbas Omar
Univ. of Magdeburg
501-502
Abstract
Millimeter Wave mobile communication (5G and beyond) has been associated with much lower radiation power and much shorter communication range. Millimeter Wavelengths suffer from very strong attenuation in water-rich substances limiting penetration into biological objects (e.g., human and animal bodies and plants) to just a few millimeters. Deeper inside the body the intensity is negligible making for greater safety compared to early mobile standards (3G and 4G). However, the safety of millimeter-wave radiation for 5G and beyond remains a public concern. 
This Technical Lecture aims to comprehensively review the relevant electromagnetic fundamentals underlying the wave-matter interaction involved in any eventual health hazard which might be associated with millimeter-wave radiation. Basic related aspects include the following: 
•Direct health hazards must involve either chemical reactions or thermal/mechanical destruction of cells/tissues. This must be accompanied by energy transfer from the electromagnetic wave to the biological substances.
•Indirect hazards include overloading the biological mechanisms involved in the body thermoregulation. 
•Thermal effects involve rise of temperature, an increase in the magnitude of atomic/molecular lattice vibrations.Chemical reactions (e.g., burning) will only occur if the temperature increase exceeds a certain limit. Otherwise, the rise is reversible, regulated to steady state by the blood circulation within the body. 
•Non-ionizing waves are wavelengths that are much larger than the atomic/molecular scale, a continuous spatial distribution of the wave is an adequate mathematical representation. The wave power-density is described by the Poynting vector, and the power transfer from the wave to the biological substances can be calculated with high precision using the concept of constitutive parameters (conductivity, permittivity, and permeability). Millimeter Waves and even Tera-Hertz Waves belong to this category. 
•Ionizing radiation has wavelengths comparable to the interatomic or intermolecular spaces and an electromagnetic wave quantization approach makes sense. Wave-matter interactions can be explained using the discrete representation of the waves, photons, which are ensembles of energy packages highly localized in time and space. A single photon carries energy proportional to its frequency which, e.g., can be fully transferred to and result in electrical destruction of a molecular bond. Ionizing radiation only occurs at frequencies much higher than that of ultraviolet light and therefore is not applicable to the millimeter-wave case. 
•Use of a photon representation to describe Millimeter Waves would require the photon spatial extent to be of the same order of magnitude as the wavelength and a photon collision would necessarily involve millions of atoms/ molecules (as if swimming in it). A single chemical bond could not absorb the entire photon energy  


Speaker Bio: Abbas Omar received the B.Sc., M.Sc. and Doktor-Ing. degrees in electrical engineering in 1978, 1982 and 1986, respectively. He has been professor of electrical engineering since 1990 and director of the Chair of Microwave and Communication Engineering at the University of Magdeburg, Germany from 1998 to his retirement in 2020. He joined the Petroleum Institute in Abu Dhabias a Distinguished Professor in 2012 and 2013 as an organizer of the research activities for the Oil and Gas Industry in this area. In 2014 and 2015 he chaired the Electrical and Computer Engineering at the University of Akron, Ohio, USA. Dr. Omar authored and co-authored more than 480 technical papers extending over a wide spectrum of research areas. His current research fields cover the areas of microwave, magnetic-resonance, and acoustic imaging, microwave and millimeter-wave material characterization, phased arrays and beamforming, massive MIMO, indoor positioning, subsurface tomography and ground penetrating radar, and field theoretical modeling of microwave systems and components. He is IEEE Fellow

-

Vito Giannini
Uhnder
Vadim Issakov
Technische Univ. Braunschweig
1A-1C
Abstract
This session reports circuits and systems advances in the mm-wave and sub-THz bands, covering topics from radar sensing to precision timing. The first paper discusses a CMOS molecular clock with 20ppt stability. The two following papers focus on advances in the 76–81GHz radar automotive band detailing a SiGe detector for built-in-self-test as well as a 28nm FD-SOI low-power transceiver. An E-band pulsed phase modulated radar is also presented using analog correlators. Finally, a 29–36GHz transceiver capable of achieving both radar and communication phased-array operation is presented.
Technical Papers
Abstract
RMo3A-1: A Sub-THz CMOS Molecular Clock with 20ppt Stability at 10,000s Based on Dual-Loop Spectroscopic Detection and Digital Frequency Error Integration
Mina Kim, Cheng Wang, Lin Yi, Hae-Seung Lee, Ruonan Han
Mina Kim, MIT
MIT, MIT, Jet Propulsion Lab, MIT, MIT
(13:30 - 13:50)
Abstract
RMo3A-2: A Small-Area, Low-Power 76–81GHz HBT-Based Differential Power Detector for Built-In Self-Test in Automotive Radar Applications
Yannick Wenger, Herman Jalli Ng, Falk Korndörfer, Bernd Meinerzhagen, Vadim Issakov
Yannick Wenger, Technische Univ. Braunschweig
Technische Univ. Braunschweig, Hochschule Karlsruhe, IHP, Technische Univ. Braunschweig, Technische Univ. Braunschweig
(13:50 - 14:10)
Abstract
RMo3A-3: A Compact 28nm FD-SOI CMOS 76–81GHz Automotive Band Receiver Path with Accurate 0.2° Phase Control Resolution
Antoine Le Ravallec, Patrice Garcia, João Carlos Azevedo Gonçalves, Loïc Vincent, Jean-Marc Duchamp, Philippe Benech
Antoine Le Ravallec, STMicroelectronics
STMicroelectronics, STMicroelectronics, STMicroelectronics, CIME Nanotech, G2Elab (UMR 5269), G2Elab (UMR 5269)
(14:10 - 14:30)
Abstract
RMo3A-4: An E-Band Phase Modulated Pulse Radar SoC with an Analog Correlator
Wen Zhou, Yahya Tousi
Wen Zhou, Univ. of Minnesota
Univ. of Minnesota, Univ. of Minnesota
(14:30 - 14:50)
Abstract
RMo3A-5: A 29-to-36GHz 4TX/4RX Dual-Stream Phased-Array Joint Radar-Communication CMOS Transceiver Supporting Centimeter-Level 2D Imaging and 64-QAM OTA Wireless Link
Fuyuan Zhao, Wei Deng, Rui Wu, Haikun Jia, Qixiu Wu, Jihao Xin, Zhiyuan Zeng, Yanlei Li, Zhihua Wang, Baoyong Chi
Teerachot Siriburanon, Univ. College Dublin
Tsinghua Univ., Tsinghua Univ., CAS, Tsinghua Univ., Tsinghua Univ., CAS, CAS, CAS, RITS, Tsinghua Univ.
(14:50 - 15:10)
Subhanshu Gupta
Washington State Univ.
Bahar Jalali Farahani
Cisco
1D-1F
Abstract
This session presents novel mixed-signal building blocks dedicated to enhancing the performance of next-generation RFIC systems. The papers propose new techniques for switched-capacitor delay elements, data converters, and DC-DC converters.
Technical Papers
Abstract
RMo3B-1: A 0.2–2GHz Time-Interleaved Multi-Stage Switched-Capacitor Delay Element Achieving 448.6ns Delay and 330ns/mm² Area Efficiency
Travis Forbes, Benjamin Magstadt, Jesse Moody, Andrew Suchanek, Spencer Nelson
Travis Forbes, Sandia National Laboratories
Sandia National Laboratories, Sandia National Laboratories, Sandia National Laboratories, Sandia National Laboratories, Sandia National Laboratories
(13:30 - 13:50)
Abstract
RMo3B-2: DC to 12+GHz, +30dBm OIP3, 7.2dB Noise Figure Active Balun in 130nm BiCMOS for RF Sampling Multi-Gbps Data Converters
Siraj Akhtar, Gerd Schuppener, Tolga Dinc, Baher Haroun, Swaminathan Sankaran
Siraj Akhtar, Texas Instruments
Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments
(13:50 - 14:10)
Abstract
RMo3B-3: An 11GS/s 2×10b 20–26GHz Modulator Using Segmented Non-Linear RF-DACs and Non-Overlapping LO Signals
Victor Åberg, Christian Fager, Rui Hou, Lars Svensson
Victor Åberg, Chalmers Univ. of Technology
Chalmers Univ. of Technology, Chalmers Univ. of Technology, Ericsson Research, Chalmers Univ. of Technology
(14:10 - 14:30)
Abstract
RMo3B-4: A 345µW 1GHz Process and Temperature Invariant Constant Slope-and-Swing Ramp-Based 7-Bit Phase Interpolator for True-Time-Delay Spatial Signal Processors
Soumen Mohapatra, Chung-Ching Lin, Mohammad Chahardori, Erfan Ghaderi, Md Aminul Hoque, Subhanshu Gupta, Deukhyoun Heo
Soumen Mohapatra, Washington State Univ.
Washington State Univ., Washington State Univ., Washington State Univ., Washington State Univ., Washington State Univ., Washington State Univ., Washington State Univ.
(14:30 - 14:50)
Abstract
RMo3B-5: A 2MHz 4–48V VIN Flying-Capacitor Based Floating-Ground GaN DC-DC Converter with Real-Time Inductor Peak-Current Detection and 6µs Load Transient Response
Weizhong Chen, Chang Yang, Lei Chen, Ping Gui
Weizhong Chen, Southern Methodist Univ.
Southern Methodist Univ., Southern Methodist Univ., Texas Instruments, Southern Methodist Univ.
(14:50 - 15:10)
Wanghua Wu
Samsung
Andreia Cathelin
STMicroelectronics
4A-4C
Abstract
This session consists of five papers on advanced frequency generation techniques for 5G and IoT applications. The first paper presents a fully-synthesizable ADPLL in 12nm FinFET for BLE transmitter, which achieves a FoM of -220.7dBc with only 0.063mm² chip area. The second paper depicts a 21.8–41.6GHz sub-sampling PLL in 40nm bulk CMOS with fast locking capability and 62.7fs rms jitter for 5G application. The third paper talks about a 35GHz 0.18µm BiCMOS technology chip, investigating the benefits of multi-edge PLL solution for obtaining wide-band low jitter performance. In the fourth paper, a 14GHz low phase-noise VCO in 45nm PD-SOI CMOS shows an interesting bias feedback technique with no additional DC power supply which permits low-power operation. Finally, using a 65nm PD-SOI CMOS process, the last paper describes a low-jitter DCO solution around 28GHz that adds the benefits of injection locking and quadrature coupling for obtaining a low-jitter solution and energy efficiency.
Technical Papers
Abstract
RMo3C-1: Open-Source Fully-Synthesizable ADPLL for a Bluetooth Low-Energy Transmitter in 12nm FinFET Technology
Kyumin Kwon, Omar Abdelatty, David D. Wentzloff
Kyumin Kwon, Univ. of Michigan
Univ. of Michigan, Univ. of Michigan, Univ. of Michigan
(13:30 - 13:50)
Abstract
RMo3C-2: A 21.8–41.6GHz Fast-Locking Sub-Sampling PLL with Dead Zone Automatic Controller Achieving 62.7fs Jitter and -250.3dB FoM
Wen Chen, Yiyang Shu, Huizhen Jenny Qian, Jun Yin, Pui-In Mak, Xiang Gao, Xun Luo
Aoyang Zhang, Harvard Univ.
UESTC, UESTC, UESTC, University of Macau, University of Macau, Zhejiang Univ., UESTC
(13:50 - 14:10)
Abstract
RMo3C-3: A 59fs-rms 35GHz PLL with FoM of -241dB in 0.18µm BiCMOS/SiGe Technology
Rajath Bindiganavile, Asif Wahid, Jacob Atkinson, Armin Tajalli
Rajath Bindiganavile, Univ. of Utah
Univ. of Utah, Univ. of Utah, Univ. of Utah, Univ. of Utah
(14:10 - 14:30)
Abstract
RMo3C-4: A 14GHz-Band Harmonic Tuned Low-Power Low-Phase-Noise VCO IC with a Novel Bias Feedback Circuit in 40nm CMOS SOI
Mengchu Fang, Toshihiko Yoshimasu
Mengchu Fang, Waseda Univ.
Waseda Univ., Waseda Univ.
(14:30 - 14:50)
Abstract
RMo3C-5: A 5G 65nm PD-SOI CMOS 23.2-to-28.8GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
Romane Dumont, Magali De Matos, Andreia Cathelin, Yann Deval
Romane Dumont, STMicroelectronics
STMicroelectronics, IMS (UMR 5218), STMicroelectronics, IMS (UMR 5218)
(14:50 - 15:10)

-

Michael Schroter, Peter Zampardi
Technische Universität Dresden, Qorvo
505-507
Abstract
The focus of the workshop is to provide an overview on transistor performance limits in terms of reliably achievable RF output power of various semiconductor technologies that are presently competing for mobile radio-frequency (RF) applications such as 5G, 6G, automotive radar and imaging, operating in the mm-wave frequency range (ie 30GHz to 300GHz). Of particular interest here are power amplifiers, oscillators, Mach-Zehnder-interferometers, and all sorts of RF buffer circuits that drive transistors to their dynamic large-signal limits and are implemented in semiconductor technologies such as III-V HBTs, SiGe HBTs and FDSOI-CMOS. The presentations will explore the presently quite heterogeneous approaches for determining the transistor related safe-operating-area in terms of reliability and ruggedness for designing circuits that are supposed to deliver high output power at high frequencies in mobile applications. The workshop starts with a tutorial on the design specifications of the above mentioned circuits and the corresponding requirements for large-signal dynamic transistor operation up to the mm-wave region. Based on this motivation, several presentations will outline, for each of the technologies, the state-of-the-art of transistor characterization for RF ruggedness as well as the device physics that cause degradation and the modeling approaches for including reliability aspects in process design kits. The workshop concludes with a tutorial on existing measurements methods for large-signal device testing in the mm-wave range.
Technical Papers
Abstract
WMH-1: Mobile Large-Signal RF Circuits: Design Perspective
Nils Pohl
Nils Pohl, Ruhr-Universität Bochum
Ruhr-Universität Bochum
(13:30 - 17:00)
Materials
workshops-2022/WMH_1.pdf
Abstract
WMH-2: Characterizing and Modeling of Safe Operating Area for SiGe NPNs in Tower’s SBC18 Technology
Samir Chaudhry
Samir Chaudhry, Tower Partners Semiconductor Company
Tower Partners Semiconductor Company
(13:30 - 17:00)
Materials
workshops-2022/WMH_2.pdf
Abstract
WMH-3: Load-Pull Based RF Reliability Investigations of SiGe HBTs
Michael Schroter
Michael Schroter, Technische Universität Dresden
Technische Universität Dresden
(13:30 - 17:00)
Materials
workshops-2022/WMH_3.pdf
Abstract
WMH-4: III-V HBT Reliability
Brian Moser
Brian Moser, Qorvo
Qorvo
(13:30 - 17:00)
Materials
workshops-2022/WMH_4.pdf
Abstract
WMH-5: III-V HBT Reliability Related Device Physics
Peter Zampardi
Peter Zampardi, Qorvo
Qorvo
(13:30 - 17:00)
Materials
workshops-2022/WMH_5.pdf
Abstract
WMH-6: 22FDX MOSFET Technology — RF/mm-Wave Reliability
Wafa Arfauoi
Wafa Arfauoi, GLOBALFOUNDRIES
GLOBALFOUNDRIES
(13:30 - 17:00)
Materials
workshops-2022/WMH_6.pdf
Abstract
WMH-7: VNA-Based Large-Signal Characterization of Electronic Devices at Sub-mm-Wave Frequencies
Luca Galatro
Luca Galatro, Vertigo Technologies
Vertigo Technologies
(13:30 - 17:00)
Materials
workshops-2022/WMH_7.pdf
Abstract
WMH-8: Panel Discussion
(13:30 - 17:00)
Young-Kai Chen
II-VI
705/707/ 709/711
Abstract
Digital signal processing (DSP) is the critical element to adapt dynamic wireless propagation media and mitigate nature and man-made impairments. Today’s model-based DSP techniques function well in the stationary wireless channel, which can be easily disrupted by the random events such as in-band interference, noise and non-stationary fading channels. Emerging AI/ML techniques have demonstrated unique capability to capture and mitigate these corner cases. These AI/machine learning techniques can significantly enhance the processing capability better than the legacy model-banded DSP techniques. This workshop will illustrate several recent advances in AI-ML-based signal processing techniques to mitigate impairments, such as non-stationary channel fading, interference, and noise, in wireless channels to enable robust wireless communication and radar applications.
Technical Papers
Abstract
WMN-1: Neural Network OFDM Receiver Design and FPGA Implementation
Deniz Erdogmus, Bahar Azari, Nasim Soltani, Hai Cheng, Mauro Belgiovine, Yangyu Li, Haoqing Li, Tales Imbirba, Salvatore D'Oro, Yanzhi Wang, Pau Closas, Tommaso Melodia, Kaushik Chowdhury
Deniz Erdogmus, Northeastern Univ.
Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ.
(13:30 - 17:00)
Materials
workshops-2022/WMN_1.pdf
Abstract
WMN-2: Neural Network Signal Processing for LTE Receiver Application
Amit Bhatia, Josh Robinson, Joseph Carmack, John Majewski, Scott Kuzdeba, Joseph Farkas, Brandon Hombs, Tom Koch
Amit Bhatia, BAE Systems
BAE Systems, BAE Systems, BAE Systems, BAE Systems, BAE Systems, Signal Processing Technologies, Signal Processing Technologies, Signal Processing Technologies
(13:30 - 17:00)
Materials
workshops-2022/WMN_2.pdf
Abstract
WMN-3: Adversarial Deep-Unfolding Networks (ADNs) for Symbol Detection in Communication Systems
Hung Nguyen, H. Vincent Poor, Steven Bottone, Isidoros Doxas
Hung Nguyen, Princeton Univ.
Princeton Univ., Princeton Univ., Northrop Grumman, Northrop Grumman
(13:30 - 17:00)
Materials
workshops-2022/WMN_3.pdf
Abstract
WMN-4: Computationally Efficient AI for Extending DSP Functions in Wireless Communications and Sensing
Gil Raz, Carl Dohrman, Mark Chilenski, Ion Matei, Nicholas Destefano, Brian Donovan, Gerard Gubash
Gil Raz, Systems & Technology Research
Systems & Technology Research, Systems & Technology Research, Systems & Technology Research, PARC, Systems & Technology Research, Systems & Technology Research, Systems & Technology Research
(13:30 - 17:00)
Materials
workshops-2022/WMN_4.pdf
Abstract
WMN-5: End-to-End Auto-Encoder Communications with Interference Suppression
Tugba Erpek, Kemal Davaslioglu, Yalin Sagduyu
Yalin Sagduyu, Intelligent Automation
Intelligent Automation, Intelligent Automation, Intelligent Automation
(13:30 - 17:00)
Materials
workshops-2022/WMN_5.pdf
Abstract
WMN-6: Neuro-Adaptive Query-Driven Radar Beamforming
Jeffrey Krolik, Michael Martinez, Huanrui Yang, Jingchi Zhang, Hai Li
Jeffrey Krolik, Duke Univ.
Duke Univ., Duke Univ., Duke Univ., Duke Univ., Duke Univ.
(13:30 - 17:00)
Materials
workshops-2022/WMN_6.pdf
Abstract
WMN-7: Emerging Efficient AI/ML Processing for Edge Applications
Young-Kai Chen
Young-Kai Chen, II-VI
II-VI
(13:30 - 17:00)
Materials
workshops-2022/WMN_7.pdf
Chris Holloway, Shane Verploegh
NIST, ColdQuanta
708/710/ 712
Abstract
In the past 10 years, there has been a great push in the development of a fundamentally new International System of Units (SI) traceable approach to electric field sensing. Atom-based measurements allow for this direct SI-traceability, and as a result, usage of Rydberg atoms (traceable through Planck’s constant) have greatly matured via measurement techniques and sensor head developments. Current Rydberg atom sensors have the capability of measuring amplitude, polarization, and phase of RF fields. Promising benefits of this quantum technology for RF receivers are the extremely large tuning range from DC fields to the submillimeter range, high selectivity in the instantaneous RF bandwidth from the nature of atomic transitions at each frequency choice, and the frequency-independent size of the sensor head. Applications of these sensors include SI-traceable E-field probes, voltage standards, power sensors, microwave radiometers, direction of arrival estimation, radar and communication receivers with amplitude, frequency, and phase modulated signal discrimination, and many others. This workshop will give an overview and summarize this new technology, discuss various applications, and pathways to commercialization.
Technical Papers
Abstract
WMP-1: An Overview of Rydberg Atom-Based Sensors
Chris Holloway
Chris Holloway, NIST
NIST
(13:30 - 17:00)
Materials
workshops-2022/WMP_1.pdf
Abstract
WMP-2: High Spectral Resolution Rydberg Atom-Based Sensing for Radio Frequency Metrology
James Shaffer
James Shaffer, Quantum Valley Ideas Lab
Quantum Valley Ideas Lab
(13:30 - 17:00)
Materials
workshops-2022/WMP_2.pdf
Abstract
WMP-3: Rydberg Atoms for RF Applications
David Anderson
David Anderson, Rydberg Technologies
Rydberg Technologies
(13:30 - 17:00)
Materials
workshops-2022/WMP_3.pdf
Abstract
WMP-4: Engineering Advancement Towards Integrating Rydberg Atom Systems
Shane Verploegh
Shane Verploegh, ColdQuanta
ColdQuanta
(13:30 - 17:00)
Materials
workshops-2022/WMP_4.pdf
Abstract
WMP-5: Rydberg Electric Field Sensor Application Spaces
Charles Fancher
Charles Fancher, MITRE
MITRE
(13:30 - 17:00)
Materials
workshops-2022/WMP_5.pdf
Abstract
WMP-6: Panel Discussion
(13:30 - 17:00)

-

Jennifer Kitchen
Arizona State Univ.
Steven Callender
Intel
1A-1C
Abstract
In this session, we present four papers on power amplifiers operating at 100GHz and above. The first two papers will present power amplifiers designed in cutting-edge technology nodes (22nm FDSOI and 16nm FinFET), each leveraging unique features of the process technology to improve PA performance — back-gate bias in FD-SOI and a skip-layer via technology in 16nm FinFET. The last two papers demonstrate PAs with output powers > +15dBm.
Technical Papers
Abstract
RMo4A-1: A 22nm FD-SOI CMOS 2-Way D-Band Power Amplifier Achieving PAE of 7.7% at 9.6dBm OP1dB and 3.1% at 6dB Back-Off by Leveraging Adaptive Back-Gate Bias Technique
Elham Rahimi, Farhad Bozorgi, Gernot Hueber
Gernot Hueber, Silicon Austria Labs
Keysight Technologies, Barkhausen Institut, Silicon Austria Labs
(15:40 - 16:00)
Abstract
RMo4A-2: An F-Band Power Amplifier with Skip-Layer Via Achieving 23.8% PAE in FinFET Technology
Qiang Yu, Jeffrey Garrett, Seahee Hwangbo, Georgios Dogiamis, Said Rami
Qiang Yu, Intel
Intel, Intel, Intel, Intel, Intel
(16:00 - 16:20)
Abstract
RMo4A-3: A 97–107GHz Triple-Stacked-FET Power Amplifier with 23.7dB Peak Gain, 15.1dBm PSAT, and 18.6% PAEMAX in 28nm FD-SOI CMOS
Kyunghwan Kim, Kangseop Lee, Seung-Uk Choi, Jiseul Kim, Chan-Gyu Choi, Ho-Jin Song
Kyunghwan Kim, POSTECH
POSTECH, POSTECH, POSTECH, POSTECH, POSTECH, POSTECH
(16:20 - 16:40)
Abstract
RMo4A-4: A 124–152GHz >15dBm Psat 28nm CMOS PA Using Chebyshev Artificial-Transmission-Line-Based Matching for Wideband Power Splitting and Combining
Jincheng Zhang, Tianxiang Wu, Yong Chen, Junyan Ren, Shunli Ma
Li Zhang, Univ. of California, Davis
Fudan Univ., Fudan Univ., University of Macau, Fudan Univ., Fudan Univ.
(16:40 - 17:00)
Alvin Joseph
GLOBALFOUNDRIES
Edward Preisler
Tower Partners Semiconductor Company
1D-1F
Abstract
This session will cover the technology tradeoffs in 78fs/3.7V RFSOI switch, planar RFSOI CMOS and FinFET power amplifier device reliability characterization, and closing out with a FinFET SCR based ESD structure for RF applications.
Technical Papers
Abstract
RMo4B-1: Advanced 200mm RF SOI Technology Exhibiting 78fs RON×COFF and 3.7V Breakdown Voltage Targeting Sub 6GHz 5G FEM
F. Gianesello, A. Fleury, F. Julien, J. Dura, S. Monfray, S. Dhar, C.A. Legrand, J. Amouroux, B. Gros, L. Welter, C. Charbuillet, P. Cathelin, E. Canderle, N. Vulliet, E. Escolier, L. Antunes, E. Granger, P. Fornara, C. Rivero, G. Bertrand, P. Chevalier, A. Regnier, D. Gloria
F. Gianesello, STMicroelectronics
STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics, STMicroelectronics
(15:40 - 16:00)
Abstract
RMo4B-2: Superior Reliability and Low Self-Heating of a 45nm CMOS 39GHz Power Amplifier for 5G mmWave Applications
P. Srinivasan, S. Syed, J.A. Sundaram, S. Moss, S. Jain, P. Colestock, N. Cahoon, A. Bandyopadhyay, F. Guarin, B. Min, M. Gall
P. Srinivasan, GLOBALFOUNDRIES
GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES
(16:00 - 16:20)
Abstract
RMo4B-3: Impact of Non-Conducting RF and DC Hot Carrier Stresses on FinFET Reliability for RF Power Amplifiers
X. Ding, G. Niu, H. Zhang, W. Wang, K. Imura, F. Dai
X. Ding, Auburn Univ.
Auburn Univ., Auburn Univ., MaxLinear, MaxLinear, MaxLinear, Auburn Univ.
(16:20 - 16:40)
Abstract
RMo4B-4: Device for Protecting High Frequency and High Data Rate Interface Applications in FinFET Process Technologies
Srivatsan Parthasarathy, Ray Shumovich, Javier Salcedo, Roxann Broughton-Blanchard, J.-J. Hajjar
Srivatsan Parthasarathy, Analog Devices
Analog Devices, Analog Devices, Analog Devices, Analog Devices, Analog Devices
(16:40 - 17:00)
Teerachot Siriburanon
Univ. College Dublin
Howard C. Luong
HKUST
4A-4C
Abstract
In this session, four papers present the recent advancements in oscillator designs for various frequencies. The first paper will present 8.2–10.2GHz digitally controlled oscillator (DCO) leveraging the proposed switchable capacitor structure with a constantly conducting NMOS pair, featuring an SC bank with unitary cells, achieving fine resolution. In the second paper, a 28nm CMOS 14–17GHz CMOS quad-core class-B DCO with transformer cross coupling among the 4 VCO cores which achieves -117.3dBc/Hz from a 15.35GHz carrier. The third paper will present compact super-harmonic VCO operating at 78.9GHz. Good phase noise of -108dBc/Hz and FOM of -189dBc/Hz at 1MHz offset is achieved by leveraging the strong presence of a second harmonic. Finally, the fourth paper will present a switch-less reconfigurable triple-push and push-push dual-band VCO topology at 91GHz and 102GHz with a phase noise performance of -109dBc/Hz at a 10MHz offset for 105.3GHz carrier.
Technical Papers
Abstract
RMo4C-1: An 8.2–10.2GHz Digitally Controlled Oscillator in 28nm CMOS Using Constantly-Conducting NMOS Biased Switchable Capacitor
Lantao Wang, Jonas Meier, Johannes Bastl, Tim Lauber, Andreas Köllmann, Ulrich Möhlmann, Michael Hanhart, Alexander Meyer, Christopher Nardi, Ralf Wunderlich, Stefan Heinen
Tim Lauber, RWTH Aachen Univ.
RWTH Aachen Univ., RWTH Aachen Univ., RWTH Aachen Univ., RWTH Aachen Univ., NXP Semiconductors, NXP Semiconductors, RWTH Aachen Univ., RWTH Aachen Univ., RWTH Aachen Univ., RWTH Aachen Univ., RWTH Aachen Univ.
(15:40 - 16:00)
Abstract
RMo4C-2: A 14.5–17.9GHz Harmonically-Coupled Quad-Core P-N Class-B DCO with -117.3dBc/Hz Phase Noise at 1MHz Offset in 28nm CMOS
Ioanna Apostolina, Danilo Manstretta
Ioanna Apostolina, Università di Pavia
Università di Pavia, Università di Pavia
(16:00 - 16:20)
Abstract
RMo4C-3: A Compact CMOS 76–82GHz Super-Harmonic VCO with 189dBc/Hz FoM Operating Based on Harmonic-Assisted ISF Manipulation
Behnam Moradi, Xuyang Liu, Michael M. Green, Hamidreza Aghasi
Behnam Moradi, Univ. of California, Irvine
Univ. of California, Irvine, Univ. of California, Irvine, Univ. of California, Irvine, Univ. of California, Irvine
(16:20 - 16:40)
Abstract
RMo4C-4: Sub-THz Switch-Less Reconfigurable Triple-/Push-Push Dual-Band VCO for 6G Communication
Seongwoog Oh, Jinhyun Kim, Jungsuek Oh
Seongwoog Oh, Seoul National Univ.
Seoul National Univ., Seoul National Univ., Seoul National Univ.
(16:40 - 17:00)

-

Larry Hawkins
Richardson RFPD
205/207
Abstract
mmWave is the new frontier in RF design. There are many advantages of working at these frequencies and more opportunity as more bands are opened for different applications. There are also many difficulties, especially for those that do not have a lot of experience. Richardson RFPD has made available a 24-44 GHz up-down converter design accelerator to help alleviate some of those difficulties. It can be used as to help demonstrate a concept to your customer, to start your algorithm development, or as a reference design. The workshops goal is to demonstrate and to show its applications.
Hao Gao
Silicon Austria Labs
Marcus Granger-Jones
Qorvo
1A-1C
Abstract
The four papers show noise optimization in the mm-wave CMOS low noise amplifier. The first three papers show LNAs targeting mm-wave 5G application, and the last paper for the broadband application. The 5G papers explore the benefit of using inductive coupling around input stage and between stages to extend the bandwidth and improve the noise match. In the wideband paper the author demonstrates an FD SOI LNA using the back gate connection as part of the input match to extend the bandwidth of the power match.
Technical Papers
Abstract
RTu1A-1: 28GHz Compact LNAs with 1.9dB NF Using Folded Three-Coil Transformer and Dual-Feedforward Techniques in 65nm CMOS
Xiangrong Huang, Haikun Jia, Wei Deng, Zhihua Wang, Baoyong Chi
Xiaolin Wang, Okada Laboratory
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., RITS, Tsinghua Univ.
(08:00 - 08:20)
Abstract
RTu1A-2: 22–33GHz CMOS LNA Using Coupled-TL Feedback and Self-Body Forward-Bias for 28GHz 5G System
Yo-Sheng Lin, Kai-Siang Lan
Yo-Sheng Lin, National Chi Nan Univ.
National Chi Nan Univ., National Chi Nan Univ.
(08:20 - 08:40)
Abstract
RTu1A-3: A Capacitor Assisting Triple-Winding Transformer Low-Noise Amplifier with 0.8–1.5dB NF 6–12GHz BW ±0.75dB Ripple in 130nm SOI CMOS
Tenghao Zou, Hao Xu, Yizhuo Wang, Weitian Liu, Tingting Han, Zengqi Wang, Nan Li, Mi Tian, Weiqiang Zhu, Na Yan
Dihang Yang, Broadcom Corp.
Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., CASIC IT Academy, Archiwave Microelectronics, Archiwave Microelectronics, CASIC IT Academy, CASIC IT Academy, Fudan Univ.
(08:40 - 09:00)
Abstract
RTu1A-4: An LNA with Input Power Match from 6.1 to 38.6GHz, the Noise-Figure Minimum of 1.9dB, and Employing Back Gate for Matching
Mohammad Radpour, Leonid Belostotski
Mohammad Radpour, Univ. of Calgary
Univ. of Calgary, Univ. of Calgary
(09:00 - 09:20)
SungWon Chung
Neuralink
Alexandre Giry
CEA-LETI
1D-1F
Abstract
This session presents power efficiency enhancement techniques utilizing advanced Doherty PAs and switched-capacitor PAs. Three-way Doherty PA for mm-wave 5G NR OFDM as well as polar Doherty PA with self-calibration, hybrid digital Doherty PA, and Class-G switched-capacitor PA for sub-6GHz will be presented.
Technical Papers
Abstract
RTu1B-1: A 38GHz Deep Back-Off Efficiency Enhancement PA with Three-Way Doherty Network Synthesis Achieving 11.3dBm Average Output Power and 14.7% Average Efficiency for 5G NR OFDM
Xiaohan Zhang, Sensen Li, Daquan Huang, Taiyun Chi
Xiaohan Zhang, Rice Univ.
Rice Univ., Samsung, Samsung, Rice Univ.
(08:00 - 08:20)
Abstract
RTu1B-2: A Polar Doherty SCPA with 4.4° AM-PM Distortion Using On-Chip Self-Calibration Supporting 64-/256-/1024-QAM
Hongxin Tang, Huizhen Jenny Qian, Bingzheng Yang, Tianyi Wang, Xun Luo
Aoyang Zhang, Harvard Univ.
UESTC, UESTC, UESTC, UESTC, UESTC
(08:20 - 08:40)
Abstract
RTu1B-3: A Compact Single Transformer Footprint Hybrid Current-Voltage Digital Doherty Power Amplifier
Jeongseok Lee, Doohwan Jung, David Munzer, Hua Wang
Jeongseok Lee, Georgia Tech
Georgia Tech, Georgia Tech, Georgia Tech, Georgia Tech
(08:40 - 09:00)
Abstract
RTu1B-4: An Eight-Core Class-G Switched-Capacitor Power Amplifier with Eight Power Backoff Efficiency Peaks
Bo Qiao, Ajmal V. Kayyil, David J. Allstot
Bo Qiao, Oregon State Univ.
Oregon State Univ., Oregon State Univ., Oregon State Univ.
(09:00 - 09:20)

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505-507
Abstract
The Connected Future Summit (formerly the 5G Summit) has been held during IMS since its inception at IMS2017 in collaboration with IEEE Communications Society (Comsoc). The event provides a platform for academic, government and industrial communities to interact and exchange technology ideas related to technologies of 5G and beyond. The Connected Future Summit committee is part of the IMS Technical Program Committee and is responsible for selecting timely topics and inviting speakers to create an agenda. This event has been getting sponsorships from industry with encouraging attendance every year ranging from about 300 to 400 attendees.

In addition to the technology advancements with 5G and beyond (toward 6G), the wireless connectivity landscape is changing rapidly with the evolution of Wi-Fi and broadband wireless satellite networks based on Low-Earth Orbit satellite constellations. The 5G standardization, deployment and R&D of next generations are impacting the future directions of connectivity in coordination with beyond Wi-Fi 7 technologies and broadband satellite networks. 

Click Here to View the Connected Future Summit Agenda and Speakers

The Connected Future Summit will be held on 21June 2022 at IMS2022 in Denver. The Summit will review core technologies for future wireless networks along with their human and societal impacts. The day-long program will feature experts from industry, government and academia sharing technical knowledge and strategies. The topics will include future trends of 6G and beyond; standardization of both cellular (3GPP) and Wi-Fi Alliance; broadband wireless with satellite constellations and other high-altitude platform; V2X technology with beyond 5G; semiconductor technologies; reconfigurable front ends and system architectures; and test and measurement challenges impacting next-generation connectivity evolution. Please join the Connected Future Summit to learn about the future of connectivity!

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David Vye
Cadence
205/207
Abstract
Advances in front-end RFIC electronics and highly integrated RF PCB designs are making it possible to adopt phased-array systems for commercial mmWave applications. This workshop explores recent developments in mmWave technology from the perspective of EM simulation, in-situ circuit simulation, phased-array synthesis, and RF PCB design. The system requirements that drive antenna/front-end architectural decisions for mmWave applications, antenna optimization, and array configuration and generation will be discussed and the use of RF system design software for link budget analysis will be demonstrated.

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Mona Mostafa Hella, Oren Eliezer, Francois Rivet, Aida Vera Lopez
Rensselaer Polytechnic Institute, Apogee Semiconductors, Univ. of Bordeaux, Intel Corp.
Khurram Muhammad, Shahriar Shahramian, Omar Bakr, Jon Strange, Emilio Calvanese Strinati, Mike Noonen, Reza Arefi
4A-4C
Abstract
Who could have imagined a decade ago that mmWave would be a candidate for wireless communications, namely 5G? With major investments from network operators, system architects, and chip makers to make it happen, should we even question mmWave 5G practicality and economics? And if mmWave does dominate 5G, would that mean the road is paved for THz in 6G? This panel of international experts from various industry sectors and academia will discuss the technical practicality and economics of 5G mmW deployment and assess the potential for use of even higher frequency bands (D-Band and above) in next-generation communications.

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Michael Foegelle, Dennis Lewis, Lawrence Moore
ETS-Lindgren, Boeing, Ericsson
205/207
Abstract
5G and emerging wireless technologies are being considered in a wide range of spectrum bands to support a significantly increased user density. With the industry’s adoption of multi-user MIMO, massive MIMO, and mmWave in emerging wireless systems, several worldwide industries and standards bodies face new measurement challenges in NR OTA testing to verify products meet intended performance parameters demanded by diverse technological requirements. Applications in diverse environments, such as commercial aircraft and base stations, will be reviewed. Experts and active contributors to the 5G wireless industry standards committees will review these challenges and propose novel solutions.
David Daughton, Suren Singh, Nizar Messaoudi
Lake Shore Cryotronics, Keysight Technologies
403/404
Abstract
2-port S-parameter characterization of wafer-level devices at cryogenic temperatures has a relatively long history; however, there has been considerably less work on differential/mixed-mode S-parameter characterization in these environments. With the emergence of cryogenic temperature microwave systems for quantum computing, there is increasing interest in high frequency integrated circuit design with differential signaling for cold environments. Here we will discuss the instrumentation, probes, calibrations, and environmental consideration for wafer-level characterization of differential devices at cryogenic temperatures and magnetic fields.
Roxann Broughton-Blanchard
Analog Devices
Mohyee Mikhemar
Broadcom
1A-1C
Abstract
This session presents novel building blocks and techniques for half and full-duplex integrated transceivers. For full-duplex systems, self-interference cancelers using N-path techniques to realize delay lines are presented. A flexible half-duplex technique and integrated circulator round out this session.
Technical Papers
Abstract
RTu3A-1: An Integrated Reconfigurable SAW-Less Quadrature Balanced N-Path Transceiver for Frequency-Division and Half Duplex Wireless
Erez Zolkov, Nimrod Ginzberg, Emanuel Cohen
Erez Zolkov, Technion
Technion, Technion, Technion
(13:30 - 13:50)
Abstract
RTu3A-2: A 0.5–4GHz Full-Duplex Receiver with Multi-Domain Self-Interference Cancellation Using Capacitor Stacking Based Second-Order Delay Cells in RF Canceller
Chuangguo Wang, Wei Li, Fan Chen, Wen Zuo, Yunyou Pu, Hongtao Xu
Jin Zhou, Univ. of Illinois
Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ.
(13:50 - 14:10)
Abstract
RTu3A-3: A 2Gb/s 9.9pJ/b Sub-10GHz Wireless Transceiver for Reconfigurable FDD Wireless Networks and Short-Range Multicast Applications
Renzhi Liu, Asma Beevi K. T., Richard Dorrance, Timothy Cox, Rinkle Jain, Tolga Acikalin, Zhen Zhou, Tae-Young Yang, Johanny Escobar-Pelaez, Shuhei Yamada, Kenneth Foust, Brent Carlton
Renzhi Liu, Intel
Intel, Intel, Intel, Intel, Intel, Intel, Intel, Intel, Intel, Intel, Intel, Intel
(14:10 - 14:30)
Abstract
RTu3A-4: Fully Integrated Ultra-Wideband Differential Circulator Based on Sequentially Switched Delay Line in 28nm FDSOI CMOS
Jun Hwang, Byung-Wook Min
Jun Hwang, Yonsei Univ.
Yonsei Univ., Yonsei Univ.
(14:30 - 14:50)
Abstract
RTu3A-5: A C-Band Commutated-LC-Negative-R Delay Circuit with Harmonic Power Recycling Achieving 1.5ns Delay, 1.4GHz BW, and 6dB IL
Shuxin Ming, Rakibul Islam, Jin Zhou
Shuxin Ming, Univ. of Illinois at Urbana-Champaign
Univ. of Illinois at Urbana-Champaign, Univ. of Illinois at Urbana-Champaign, Univ. of Illinois at Urbana-Champaign
(14:50 - 15:10)
Mona Hella
Rensselaer Polytechnic Institute
Fabio Sebastiano
Technische Universiteit Delft
1D-1F
Abstract
This session presents advances in mm-wave/THz device technology, built-in self-testing and on-chip calibration as well as basic building blocks for emerging applications in quantum computing. The session starts with a talk on a low noise FET (LNFET) with the highest reported fT/fMAX of 325/475GHz in 45nm partially depleted Silicon On Insulator technology for Ku/K/Ka band applications in SATCOM. The following paper describes a BIST for the characterization of active antenna impedance and VSWR resilient channel response. The third talk introduces a single-element VNA electronic calibration (E-Cal) technique in 65nm CMOS technology. The next paper demonstrates of a multi-tone signal generator that can reduce the number of interconnects between the control electronics and the core processor for next generation quantum computers. The session ends with a 263GHz dual-channel CMOS energy harvester for ultra-miniaturized platforms with 13.6% RF-to-DC conversion efficiency at -8dBm input.
Technical Papers
Abstract
RTu3B-1: LNFET Device with 325/475GHz fT/fMAX and 0.47dB NFMIN at 20GHz for SATCOM Applications in 45nm PDSOI CMOS
S.V. Khokale, T. Ethirajan, H.K. Kakara, B. Humphrey, K. Shanbhag, V. Vanukuru, V. Jain, S. Jain
S.V. Khokale, GLOBALFOUNDRIES
GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES, GLOBALFOUNDRIES
(13:30 - 13:50)
Abstract
RTu3B-2: E-Band CMOS Built-In Self-Test Circuit Capable of Testing Active Antenna Impedance and Complex Channel Response
Seung-Uk Choi, Kyunghwan Kim, Kangseop Lee, Seunghoon Lee, Ho-Jin Song
Seung-Uk Choi, POSTECH
POSTECH, POSTECH, POSTECH, POSTECH, POSTECH
(13:50 - 14:10)
Abstract
RTu3B-3: Millimeter-Wave VNA Calibration Using a CMOS Transmission Line with Distributed Switches
Jun-Chau Chien
Jun-Chau Chien, National Taiwan Univ.
National Taiwan Univ.
(14:10 - 14:30)
Abstract
RTu3B-4: Multi-Tone Frequency Generator for Gate-Based Readout of Spin Qubits
Mathilde Ouvrier-Buffet, Alexandre Siligaris, José Luis Gonzalez-Jimenez
Alexandre Siligaris, CEA-LETI
CEA-LETI, CEA-LETI, CEA-LETI
(14:30 - 14:50)
Abstract
RTu3B-5: A Dual-Antenna, 263GHz Energy Harvester in CMOS for Ultra-Miniaturized Platforms with 13.6% RF-to-DC Conversion Efficiency at -8dBm Input Power
Muhammad Ibrahim Wasiq Khan, Eunseok Lee, Nathan M. Monroe, Anantha P. Chandrakasan, Ruonan Han
Muhammad Ibrahim Wasiq Khan, MIT
MIT, MIT, MIT, MIT, MIT
(14:50 - 15:10)

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Nizar Messaoudi, Jack DeGrave
Keysight Technologies, FormFactor
205/207
Abstract
Until recently, quantum engineers operating devices at milli-Kelvin temperatures are faced with the difficulties and inconveniences of long development cycles. The major bottlenecks include time-consuming wire bonding, expensive packaging processes prior to device cooldown, and long cooldown times for dilution refrigerators. This workshop presents an integrated measurement solution for Pre-Screening qubit devices, allowing quantum engineers to eliminate wire-bonding and packaging from cryogenic test processes and to provide critical qubit performance parameters at 50 mK, thus streamlining device deployment, and reducing the time for development cycles.
David D. Wentzloff
Univ. of Michigan
Arun Paidimarri
IBM T.J. Watson Research Center
1A-1C
Abstract
This session presents emerging wireless communication techniques across various frequencies, power levels and applications. We start with a 802.11ah transmitter for the TV white space bands while meeting stringent emission specs. Following this is a wake-up receiver that uses frequency hopping two-tone modulation for improved performance in the presence of blockers. The third paper is a receiver that leverages a time-varying n-path filter for improved signal-to-interference rejection. The final paper is a MIMO receiver array that uses time-modulation to create multiple simultaneous beams that are mapped to a single-wire IF interface.
Technical Papers
Abstract
RTu4A-1: 802.11ah Transmitter with -55dBr at ±3MHz and -58dBr at ±20MHz ACLR and 60dB 2nd-Order Harmonic Rejection for 470MHz ~ 790MHz TV White Space Band Devices
Seong-Sik Myoung, Jonghoon Park, Chang Hun Song, Ryun Woo Kim, Jaeyoung Ryu, Jeongki Choi, Hoai-Nam Nguyen, Seungyun Lee, Ilyong Jung, Jong-Han Lim, Sok Kyu Lee
Seong-Sik Myoung, Newracom
Newracom, Newracom, Newracom, Newracom, Newracom, Newracom, Newracom, Newracom, Newracom, Newracom, Newracom
(15:40 - 16:00)
Abstract
RTu4A-2: A 915MHz 19µW Blocker-Enhanced Wake-Up Receiver with Frequency-Hopping Two-Tone Modulation Achieving 53dB Tolerance to In-Band Interference
Heyu Ren, Dawei Ye, Binbin Chen, Xu Jin, Wenjun Gong, Rongjin Xu, C.-J. Richard Shi
C.-J. Richard Shi, Univ. of Washington
Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Fudan Univ., Univ. of Washington
(16:00 - 16:20)
Abstract
RTu4A-3: A 320µW Receiver with -58dB SIR Leveraging a Time-Varying N-Path Filter
Milad Moosavifar, Yaswanth K. Cherivirala, David D. Wentzloff
Milad Moosavifar, Univ. of Michigan
Univ. of Michigan, Univ. of Michigan, Univ. of Michigan
(16:20 - 16:40)
Abstract
RTu4A-4: A 26-to-33GHz Time-Modulated Spectral-Spatial Mapping MIMO Receiver Array with Concurrent Steerable Multi-Beams Using Only One Beamformer and One Single-Wire Interface
Tzu-Yuan Huang, Boce Lin, Naga Sasikanth Mannem, Hua Wang
Tzu-Yuan Huang, Georgia Tech
Georgia Tech, Georgia Tech, Georgia Tech, Georgia Tech
(16:40 - 17:00)
Joseph D. Cali
Raytheon
Ehsan Afshari
Univ. of Michigan
1D-1F
Abstract
In this session, four authors present advancements in diverse frequency synthesis technology components. Our first paper will show state-of-the-art BAW performance enabled by directly integrating a BAW to a die containing a PLL and applying factory trim. The potential advantages over quartz crystal based oscillators for some applications will be discussed. Our second paper is a 6X frequency multiplier that employs a non-intuitive broadband phase compensation technique. Our third paper presents a digital-to-time converter optimized for sinusoidal signals achieving fine resolution and large range. Our fourth and final paper presents a high accuracy LO phase shifter that operates in E-Band. We encourage the attendees to find creative ways to extend and combine the ideas presented here into new frequency synthesis systems.
Technical Papers
Abstract
RTu4B-1: Class-C BAW Oscillator Achieving a Close-In FOM of 206.5dB at 1kHz with Optimal Tuning for Narrowband Wireless Systems
Bichoy Bahr, Danielle Griffith, Ali Kiaei, Thomas Tsai, Ryan Smith, Baher Haroun
Bichoy Bahr, Texas Instruments
Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments, Texas Instruments
(15:40 - 16:00)
Abstract
RTu4B-2: A 5.1dBm 127–162GHz Frequency Sextupler with Broadband Compensated Transformer-Based Baluns in 22nm FD-SOI CMOS
Shuyang Li, Wenhua Chen, Xingcun Li, Yunfan Wang
Mohamed Helaoui, Univ. of Calgary
Tsinghua Univ., Tsinghua Univ., Tsinghua Univ., Univ. of Michigan
(16:00 - 16:20)
Abstract
RTu4B-3: A Digital-to-Time Converter Based on Crystal Oscillator Waveform Achieving 86fs Jitter in 22nm FD-SOI CMOS
Xi Chen, Teerachot Siriburanon, Zhongzheng Wang, Jianglin Du, Yizhe Hu, Anding Zhu, R. Bogdan Staszewski
Xi Chen, Univ. College Dublin
Univ. College Dublin, Univ. College Dublin, MCCI, Univ. College Dublin, Univ. College Dublin, Univ. College Dublin, Univ. College Dublin
(16:20 - 16:40)
Abstract
RTu4B-4: Highly Accurate Frequency Quadrupler Based LO Phase Shifter Achieving 0.29° RMS Phase Error for Wideband E-Band Beamforming Receiver
Kangseop Lee, Chan-Gyu Choi, Kyunghwan Kim, Seunghoon Lee, Seung-Uk Choi, Jayol Lee, Bontae Koo, Ho-Jin Song
Kangseop Lee, POSTECH
POSTECH, POSTECH, POSTECH, POSTECH, POSTECH, ETRI, ETRI, POSTECH
(16:40 - 17:00)

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Gavin Fisher
FormFactor
205/207
Abstract
We will highlight the best methods for setting up, calibrating, and evaluating measurement performance in coaxial and waveguide bands spanning WR15 (75 GHz) to WR1 (1100 GHz) over a broad (-40 to 125c) temperature range A novel out single sweep measurement from 900 Hz to 220 GHz will be shown along with detailed complete automation of these measurements Hany programming examples using WinCalXE software will be demonstrated automating data measurement and analysis for on wafer measurements. We also evaluate system stability and performance. A very conventient approach is discussed to allow safe and convenience band swaps and probe installation

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Michael Thompson, Ron Pongratz
Cadence
205/207
Abstract
The need to design and produce smaller, less expensive, and increasingly complex devices is the mantra of our industry. This has led to designs in smaller, more complex packages, smaller process nodes, and the use of multiple IC technologies, all within a shorter design cycle. This workshop will consider recent developments in EDA software that address the challenges of adopting advanced node silicon and heterogenous packaging technology for RF to mmWave applications.

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Gareth Lloyd, Diamond Liu, Salvatore Finocchiaro
Rohde & Schwarz, SynMatrix Technologies, QORVO, Inc.
205/207
Abstract
5G is here. The focus is on improving systems and enhancing capabilities. This drives the integration of components, extending bandwidth coverage per RF channel and improving energy efficiency. We will look at enhanced filter and amplifier design and testing. Load Modulated Balanced Amplifier (LMBA) structures offer typically Doherty levels of efficiency with increased bandwidth. The workshop will provide an overview of the latest technologies and requirements of RF frontends. Experts from test and measurement and industry partners will provide solutions that meet demanding requirements and help to develop latest LMBA topologies using a measurement-aided approach.

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Larry Hawkins
Richardson RFPD
205/207
Abstract
We will demonstrate and discuss the BytePipe Toolbox for Matlab and Simulink which provides a set of tools for interfacing, modeling, and targeting designs using the BytePipe RF System on Module. The device interfaces will provide control and data streaming using MATLAB System Objects and Simulink Blocks. The control interface allows for configuration of components included in the Software Development Kit. This includes support for configuration of the ADI ADRV9002 Agile Transceiver and Xilinx ZynqMP Baseband Processor functions. Individual settings can be configured independently or as a whole. Design support includes filter/profile wizards, and tools commonly used in modem design.

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Garth D'Abreu, Jason Coder, Jari Vikstedt, Lawrence Moore
ETS-Lindgren, NIST, Ericsson
205/207
Abstract
Achieving electromagnetic compatibility (EMC) for 5G devices is dependent upon the existence of achievable and appropriate regulatory requirements along with meaningful test methods for demonstrating compliance. This workshop will investigate new developments in test methods, focused on meeting the regulatory requirements of the FCC but with global application, with presentations focused on wireless coexistence and radiated emissions test methods. An overview of wireless coexistence measurements and challenges is presented followed by a focus on automotive applications. This is followed by an overview of emerging radiated emissions test methods and research on utilizing a reverberation methodology for faster TRP measurements.

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Malgorzata Celuch, Say Phommakesone, Marzena Olszewska-Placha, Urmi Ray, Nate Orloff, Lucas Enright
QWED Sp. z o.o., Keysight Technologies, iNEMI, NIST
205/207
Abstract
The Workshop discusses the iNEMI 5G benchmarking activity of materials’ characterization techniques relevant to 5G/mmWave applications. Four measurement methods (SCR, SPDR, BCDR, FPOR) have been identified and tested in a round-robin of 10 sample kits (including Precision Teflon, COP, and fused silica) circulated between 10 laboratories. The experimental results will be presented and the physics of the measurement process will be illustrated with FDTD, FEM, and MoM simulations. The Workshop comprises four 15 min lectures (5G industry needs; benchmarked methods and EM insight; round-robin results; best practices and recommendations) followed by 45 min hands-on excercises and 15 min discussion.
Robert Caverly
Villanova Univ.
4A-4C
Abstract
The microwave and RF design engineer always seeks to develop a design that will meet specifications the first time that the circuit is fabricated. To do so requires that as many elements and phenomenon as possible associated with the control devices and circuit be accurately modeled. In the case of the microwave and RF semiconductor control circuits, accurate modeling of the solid-state control components over frequency, voltage, current and power is key to successful control system design. This talk will cover material that will provide the RF and microwave design engineer insight into the physical operation and modeling of PIN diodes and field-effect transistors (FETs) as control components and their use in microwave and RF control circuits. The talk will cover basic RF and microwave control circuits for reconfigurable electronics, and then focus on linear and nonlinear models for PIN diode, MESFET and MOSFET control elements to implement these circuits. The talk will conclude with control circuit examples using these models for use in reconfigurable RF and microwave electronics.


Speaker Bio: Dr. Robert H. Caverly received his Ph.D. degree in electrical engineering from The Johns Hopkins University, Baltimore, MD, in 1983. He has been a faculty member at Villanova University in the Department of Electrical and Computer Engineering since 1997 and is a Full Professor. Previously, he was a Professor for more than 14 years at the University of Massachusetts Dartmouth. Dr. Caverly's research interests are focused on the characterization of semiconductor devices such as PIN diodes and FETs in the microwave and RF control environment. He has published more than 100 journal and conference papers and is the author of the books Microwave and RF Semiconductor Control Device Modeling and CMOS RFIC Design Principles, both from Artech House. An IEEE Life Fellow, Dr. Caverly is currently the Editor in Chief of the IEEE Microwave Magazine and a Track Editor for the IEEE Journal of Microwaves. He is currently an elected member of the MTT-S Administrative Committee as well as a the HF-VHF-UHF Technology and Biomedical Applications Technical Committees of the MTT Society.